Inventor
BAO XU SHENG
SG6 patents
⚠️ This page may combine multiple inventors who share the name “BAO XU SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
4 patentsUS9685350B2Jun 20, 2017
Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB
STATS CHIPPAC LTD16 citations92
US7667335B2Feb 23, 2010
Semiconductor package with passivation island for reducing stress on solder bumps
STATS CHIPPAC LTD37 citations91
US7968445B2Jun 28, 2011
Semiconductor package with passivation island for reducing stress on solder bumps
STATS CHIPPAC LTD9 citations82
US9620557B2Apr 11, 2017
Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region
STATS CHIPPAC LTD0 citations50
STATS CHIPPAC PTE LTD
2 patentsUS10741416B2Aug 11, 2020
Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB
STATS CHIPPAC PTE LTD1 citations72
US11488838B2Nov 1, 2022
Semiconductor device having an embedded conductive layer for power/ground planes in Fo-eWLB
STATS CHIPPAC PTE LTD0 citations62