P

Inventor

LI XIAOQIAN

CN31 patents
⚠️ This page may combine multiple inventors who share the name “LI XIAOQIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

20 patents
US12399334B2Aug 26, 2025

Photonic integrated circuit packaging architectures

INTEL CORP2 citations74
US12392970B2Aug 19, 2025

Photonic integrated circuit packaging architectures

INTEL CORP2 citations73
US12061371B2Aug 13, 2024

Patch on interposer architecture for low cost optical co-packaging

INTEL CORP2 citations73
US12422615B2Sep 23, 2025

Nested glass packaging architecture for hybrid electrical and optical communication devices

INTEL CORP1 citations63
US12481108B2Nov 25, 2025

Faraday rotator interconnect as a through-via configuration in a patch architecture

INTEL CORP0 citations62
US12044888B2Jul 23, 2024

Silicon groove architectures and manufacturing processes for passive alignment in a photonics die

INTEL CORP0 citations62
US11616283B2Mar 28, 2023

5G mmWave antenna architecture with thermal management

INTEL CORP0 citations62
US11522291B2Dec 6, 2022

Antenna boards and communication devices

INTEL CORP0 citations62
US12181710B2Dec 31, 2024

Photonic integrated circuit packaging architecture

INTEL CORP0 citations61
US12099245B2Sep 24, 2024

Completely encapsulated optical multi chip package

INTEL CORP1 citations61
US12353032B2Jul 8, 2025

Enabling passive alignment for lens attach

INTEL CORP0 citations59
US12174436B2Dec 24, 2024

Package expanded beam connector for on-package optics

INTEL CORP0 citations59
US12148744B2Nov 19, 2024

Optical multichip package with multiple system-on-chip dies

INTEL CORP0 citations59
US12003023B2Jun 4, 2024

In-package 3D antenna

INTEL CORP0 citations59
US12388051B2Aug 12, 2025

Barriers for grooves in photonics dies

INTEL CORP0 citations56
US12386127B2Aug 12, 2025

Micro-lens array optically coupled with a photonics die

INTEL CORP0 citations51
US12517314B2Jan 6, 2026

High bandwidth optical interconnection architectures

INTEL CORP0 citations50
US12541055B2Feb 3, 2026

Electronic device including a lens assembly

INTEL CORP0 citations47
US12158625B2Dec 3, 2024

Bidirectional optical grating coupler with multiple light paths for testing photonics devices

INTEL CORP0 citations47
US12529854B2Jan 20, 2026

Keep-out zone (KOZ) barriers to prevent epoxy flow into v-groove zone on photonics die

INTEL CORP0 citations43

BYD CO LTD

5 patents

TENCENT TECH SHENZHEN CO LTD

2 patents

BEIJING GOLDWIND SCIENCE & CREATION WINDPOWER EQUIPMENT CO LTD

1 patent

UNIV SICHUAN

1 patent

SHENZHEN YOUCHONG TECH CO LTD

1 patent

C/O NANTBIO INC

1 patent