Inventor

FUJISAWA MASAHIKO

JP25 patents

⚠️ This page may combine multiple inventors who share the name “FUJISAWA MASAHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJISAWA MASAHIKO

MITSUBISHI ELECTRIC CORP

Method of manufacturing semiconductor device

Semiconductor device comprising composite barrier layer

Structure for connecting interconnect lines with interposed layer including metal layers and metallic compound layer

Semiconductor device and its manufacturing method

Wiring structure for an integrated circuit

Semiconductor device and method for reducing contact resistance between an electrode and a semiconductor substrate

Semiconductor device with isolation insulator, interlayer insulation film, and a sidewall coating film

RENESAS ELECTRONICS CORP

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device and method of manufacture thereof

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing thereof

APIC YAMADA CORP

Method for resin molding and resin molding apparatus

Resin molding apparatus

Resin molding apparatus

Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed product

Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed product

RENESAS TECH CORP

Semiconductor device and method of manufacture thereof

Method of manufacturing structure for connecting interconnect lines including metal layer with thickness larger than thickness of metallic compound layer

Semiconductor device and method for reducing contact resistance between an electrode and a semiconductor substrate

YAMAHA ROBOTICS CO LTD

Resin sealing apparatus

Mold clamping device

Resin-sealing method

MORIMOTO NOBORU

Semiconductor device and method of manufacture thereof

MAEYAMA TETSUYA

Resin molding machine