Inventor
ROLDAN JUDITH M
US6 patents
Patents
6 patentsUS5543585AAug 6, 1996
Direct chip attachment (DCA) with electrically conductive adhesives
IBM103 citations96
US5747101AMay 5, 1998
Direct chip attachment (DCA) with electrically conductive adhesives
IBM72 citations95
US5545429AAug 13, 1996
Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
IBM25 citations92
US5310580AMay 10, 1994
Electroless metal adhesion to organic dielectric material with phase separated morphology
IBM38 citations92
US5048744ASep 17, 1991
Palladium enhanced fluxless soldering and bonding of semiconductor device contacts
IBM47 citations90
US5225711AJul 6, 1993
Palladium enhanced soldering and bonding of semiconductor device contacts
IBM13 citations71