Inventor
WARD WILLIAM C
US20 patents
⚠️ This page may combine multiple inventors who share the name “WARD WILLIAM C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS5086018AFeb 4, 1992
Method of making a planarized thin film covered wire bonded semiconductor package
IBM155 citations96
US4916519AApr 10, 1990
Semiconductor package
IBM70 citations96
US4796078AJan 3, 1989
Peripheral/area wire bonding technique
IBM166 citations96
US4878108AOct 31, 1989
Heat dissipation package for integrated circuits
IBM58 citations95
US4862245AAug 29, 1989
Package semiconductor chip
IBM670 citations95
US4447857AMay 8, 1984
Substrate with multiple type connections
IBM101 citations95
US5151559ASep 29, 1992
Planarized thin film surface covered wire bonded semiconductor package
IBM61 citations94
US4965654AOct 23, 1990
Semiconductor package with ground plane
IBM80 citations94
US4551912ANov 12, 1985
Highly integrated universal tape bonding
IBM30 citations91
US4907734AMar 13, 1990
Method of bonding gold or gold alloy wire to lead tin solder
IBM42 citations89
US4417120ANov 22, 1983
Percussive arc welding
IBM10 citations71
US4714953ADec 22, 1987
Welded wire cooling
IBM7 citations68
US4281032AJul 28, 1981
Method for coating mold
IBM4 citations51