Inventor
LIANG MUH-WANG
TW16 patents
⚠️ This page may combine multiple inventors who share the name “LIANG MUH-WANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
14 patentsUS6622883B1Sep 23, 2003
Door for wafer container having rotatable cammed member and movable links
IND TECH RES INST81 citations97
US5370524ADec 6, 1994
Clamping unit and method for an injection molding machine
IND TECH RES INST20 citations87
US9204950B2Dec 8, 2015
Plasma generator, surface treatment method using the same and surface treatment method using the same for bio-tissue
IND TECH RES INST7 citations79
US6997664B1Feb 14, 2006
Apparatus for loading/unloading wafers to and from semiconductor fabrication equipment
IND TECH RES INST7 citations71
US6653235B2Nov 25, 2003
Fabricating process for forming multi-layered metal bumps by electroless plating
IND TECH RES INST10 citations70
US7021208B2Apr 4, 2006
Compress and position apparatus
IND TECH RES INST7 citations69
US7449091B2Nov 11, 2008
Wafer electroplating apparatus
IND TECH RES INST2 citations59
US6653245B2Nov 25, 2003
Method for liquid phase deposition
IND TECH RES INST4 citations57
US6592322B2Jul 15, 2003
Personal guided transport vehicle
IND TECH RES INST6 citations56
US6382945B1May 7, 2002
Resin plunging apparatus for molding resin to seal an electronic device
IND TECH RES INST2 citations56
US11680316B2Jun 20, 2023
Deposition apparatus
IND TECH RES INST0 citations51
US10591216B2Mar 17, 2020
Solidifying device
IND TECH RES INST0 citations40
US6669185B2Dec 30, 2003
Wafer loading system positioning method and device
IND TECH RES INST0 citations40
US6803329B2Oct 12, 2004
Method for low temperature liquid-phase deposition and method for cleaning liquid-phase deposition apparatus
IND TECH RES INST0 citations36