Inventor
CHUNG BYUNG-HONG
KR17 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG BYUNG-HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
13 patentsUS6914013B2Jul 5, 2005
Method of forming semiconductor device containing oxide/nitride/oxide dielectric layer
SAMSUNG ELECTRONICS CO LTD32 citations92
US6744096B2Jun 1, 2004
Non-volatile memory device having a bit line contact pad and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD26 citations92
US6548374B2Apr 15, 2003
Method for self-aligned shallow trench isolation and method of manufacturing non-volatile memory device comprising the same
SAMSUNG ELECTRONICS CO LTD50 citations92
US5677234AOct 14, 1997
Methods of forming isolated semiconductor device active regions
SAMSUNG ELECTRONICS CO LTD24 citations92
US9142558B2Sep 22, 2015
Semiconductor device having supporter and method of forming the same
SAMSUNG ELECTRONICS CO LTD20 citations91
US7560768B2Jul 14, 2009
Nonvolatile memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US9553141B2Jan 24, 2017
Semiconductor device having supporter
SAMSUNG ELECTRONICS CO LTD10 citations83
US8970039B2Mar 3, 2015
Integrated circuit devices including electrode support structures and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD9 citations83
US7745325B2Jun 29, 2010
Wiring structure of a semiconductor device, method of forming the wiring structure, non-volatile memory device including the wiring structure, and method of manufacturing the non-volatile memory device
SAMSUNG ELECTRONICS CO LTD15 citations83
US5523255AJun 4, 1996
Method for forming a device isolation film of a semiconductor device
SAMSUNG ELECTRONICS CO LTD10 citations68
US7951671B2May 31, 2011
Method of fabricating non-volatile memory device having separate charge trap patterns
SAMSUNG ELECTRONICS CO LTD6 citations62
US7678650B2Mar 16, 2010
Nonvolatile memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations62
US7829437B2Nov 9, 2010
Method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations52