Inventor · disambiguated record
Allison Yue Xiao
Also filed as: XIAO ALLISON · XIAO ALLISON Y · XIAO ALLISON YUE
10 granted patents·6 pending applications·54 citations·filing 2005–2019
87Inventor score
Top patents by PatentIndex Score
16 records- 0191US8586650B2Thermally conductive compositionZHANG YIMIN·Filed 2010·Granted Nov 19, 2013·15 cites·16 claims
- 0288US8921464B2Adhesive compositions and use thereofHENKEL CORP·Filed 2013·Granted Dec 30, 2014·8 cites·20 claims
- 0382US10995232B2Flexible conductive inkHenkel IP & Holding GmbH·Filed 2015·Granted May 4, 2021·5 cites·12 claims
- 0481US10361016B2Electroless plating of silver onto graphiteHenkel IP & Holding GmbH·Filed 2014·Granted Jul 23, 2019·2 cites·8 claims
- 0581US7608487B2B-stageable underfill encapsulant and method for its applicationHENKEL AG & CO KGAA·Filed 2005·Granted Oct 27, 2009·11 cites·6 claims
- 0680US7722786B2Conductive materialsHENKEL AG & CO KGAA·Filed 2007·Granted May 25, 2010·10 cites·8 claims
- 0771US10999933B2Conductive material and processHenkel IP & Holding GmbH·Filed 2014·Granted May 4, 2021·1 cites·9 claims
- 0870US10923249B2Electroless plating of silver onto graphiteHenkel IP & Holding GmbH·Filed 2019·Granted Feb 16, 2021·0 cites·4 claims
- 0968US8921443B2Radiation curable temporary laminating adhesive for use in high temperature applicationsHERR DONALD E·Filed 2012·Granted Dec 30, 2014·1 cites·12 claims
- 1060US8426986B2Phase separated curable compositionsXIAO ALLISON YUE·Filed 2011·Granted Apr 23, 2013·1 cites·3 claims
- 1151US2014174801A1Conductive material and processHenkel IP & Holding GmbH·Filed 2014·Application pending·0 cites
- 1244US2013197158A1Self-aligned graphene polymer nanocompositesHENKEL CORP·Filed 2013·Application pending·0 cites
- 1344US2007014985A1Activatable compositionsYUAN-HUFFMAN QINGWEN W·Filed 2005·Application pending·0 cites
- 1443US2011147672A1Thixotropic conductive compositionYANG HUI·Filed 2010·Application pending·0 cites
- 1539US2014209951A1Oxetane-containing compounds and compositions thereofHenkel IP & Holding GmbH·Filed 2014·Application pending·0 cites
- 1633US2006194064A1Underfill encapsulant for wafer packaging and method for its applicationXIAO ALLISON Y·Filed 2006·Application pending·0 cites
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