Inventor
UEHLING TRENT S
US22 patents
⚠️ This page may combine multiple inventors who share the name “UEHLING TRENT S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
12 patentsUS7129566B2Oct 31, 2006
Scribe street structure for backend interconnect semiconductor wafer integration
FREESCALE SEMICONDUCTOR INC72 citations97
US6951801B2Oct 4, 2005
Metal reduction in wafer scribe area
FREESCALE SEMICONDUCTOR INC51 citations91
US7276435B1Oct 2, 2007
Die level metal density gradient for improved flip chip package reliability
FREESCALE SEMICONDUCTOR INC27 citations90
US8349666B1Jan 8, 2013
Fused buss for plating features on a semiconductor die
FREESCALE SEMICONDUCTOR INC15 citations84
US8008786B2Aug 30, 2011
Dynamic pad size to reduce solder fatigue
FREESCALE SEMICONDUCTOR INC7 citations83
US7772104B2Aug 10, 2010
Dynamic pad size to reduce solder fatigue
FREESCALE SEMICONDUCTOR INC13 citations83
US9703056B2Jul 11, 2017
Copper tube interconnect
FREESCALE SEMICONDUCTOR INC17 citations77
US9548256B2Jan 17, 2017
Heat spreader and method for forming
FREESCALE SEMICONDUCTOR INC5 citations72
US9373539B2Jun 21, 2016
Collapsible probe tower device and method of forming thereof
FREESCALE SEMICONDUCTOR INC3 citations64
US8368172B1Feb 5, 2013
Fused buss for plating features on a semiconductor die
FREESCALE SEMICONDUCTOR INC2 citations62
US9496212B2Nov 15, 2016
Substrate core via structure
FREESCALE SEMICONDUCTOR INC0 citations51
US9070657B2Jun 30, 2015
Heat conductive substrate for integrated circuit package
FREESCALE SEMICONDUCTOR INC0 citations36
UEHLING TRENT S
10 patentsUS9466544B2Oct 11, 2016
Semiconducitive catechol group encapsulant adhesion promoter for a packaged electronic device
UEHLING TRENT S7 citations83
US8766453B2Jul 1, 2014
Packaged integrated circuit having large solder pads and method for forming
UEHLING TRENT S3 citations61
US8704370B2Apr 22, 2014
Semiconductor package structure having an air gap and method for forming
UEHLING TRENT S2 citations61
US8314026B2Nov 20, 2012
Anchored conductive via and method for forming
UEHLING TRENT S5 citations61
US9324667B2Apr 26, 2016
Semiconductor devices with compliant interconnects
UEHLING TRENT S2 citations57
US8994190B2Mar 31, 2015
Low-temperature flip chip die attach
UEHLING TRENT S0 citations51
US8895409B2Nov 25, 2014
Semiconductor wafer plating bus and method for forming
UEHLING TRENT S1 citations51
US8519513B2Aug 27, 2013
Semiconductor wafer plating bus
UEHLING TRENT S0 citations51
US9659831B2May 23, 2017
Methods and structures for detecting low strength in an interlayer dielectric structure
UEHLING TRENT S0 citations47
US9385064B2Jul 5, 2016
Heat sink having a through-opening
UEHLING TRENT S0 citations40