Inventor
SHIM JONG-BO
KR26 patents
Patents
26 patentsUS6847109B2Jan 25, 2005
Area array semiconductor package and 3-dimensional stack thereof
SAMSUNG ELECTRONICS CO LTD153 citations98
US9997446B2Jun 12, 2018
Semiconductor package including a rewiring layer with an embedded chip
SAMSUNG ELECTRONICS CO LTD24 citations94
US10026724B2Jul 17, 2018
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD23 citations93
US7211889B2May 1, 2007
Semiconductor package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US8829686B2Sep 9, 2014
Package-on-package assembly including adhesive containment element
SAMSUNG ELECTRONICS CO LTD24 citations91
US7161249B2Jan 9, 2007
Multi-chip package (MCP) with spacer
SAMSUNG ELECTRONICS CO LTD27 citations86
US10224272B2Mar 5, 2019
Semiconductor package including a rewiring layer with an embedded chip
SAMSUNG ELECTRONICS CO LTD10 citations84
US10199319B2Feb 5, 2019
Printed circuit board and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD11 citations84
US9230876B2Jan 5, 2016
Stack type semiconductor package
SAMSUNG ELECTRONICS CO LTD13 citations84
US11637140B2Apr 25, 2023
Image sensor package
SAMSUNG ELECTRONICS CO LTD2 citations73
US10971535B2Apr 6, 2021
Image sensor package
SAMSUNG ELECTRONICS CO LTD4 citations73
US10680025B2Jun 9, 2020
Semiconductor package and image sensor
SAMSUNG ELECTRONICS CO LTD4 citations73
US10750112B2Aug 18, 2020
Substrate structures for image sensor modules and image sensor modules including the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US9899337B2Feb 20, 2018
Semiconductor package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD5 citations72
US12057366B2Aug 6, 2024
Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations71
US11600545B2Mar 7, 2023
Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US11069592B2Jul 20, 2021
Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure
SAMSUNG ELECTRONICS CO LTD3 citations71
US8922008B2Dec 30, 2014
Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structure
SAMSUNG ELECTRONICS CO LTD5 citations71
US10964618B2Mar 30, 2021
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations69
US9966364B2May 8, 2018
Semiconductor package and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations68
US7304371B2Dec 4, 2007
Lead frame having a lead with a non-uniform width
SAMSUNG ELECTRONICS CO LTD3 citations63
US12300665B2May 13, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12113087B2Oct 8, 2024
Image sensor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11227855B2Jan 18, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11908806B2Feb 20, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12283578B2Apr 22, 2025
Semiconductor package and method of fabricating same
SAMSUNG ELECTRONICS CO LTD0 citations50