Inventor
HAN SANG-UK
KR39 patents
⚠️ This page may combine multiple inventors who share the name “HAN SANG-UK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
30 patentsUS10026724B2Jul 17, 2018
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD23 citations93
US8853694B2Oct 7, 2014
Chip on film package including test pads and semiconductor devices including the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US9177904B2Nov 3, 2015
Chip-on-film package and device assembly including the same
SAMSUNG ELECTRONICS CO LTD16 citations91
US10199319B2Feb 5, 2019
Printed circuit board and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD11 citations84
US9054228B2Jun 9, 2015
Semiconductor packages including a heat spreader and methods of forming the same
SAMSUNG ELECTRONICS CO LTD12 citations83
US10361170B2Jul 23, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD11 citations82
US11637140B2Apr 25, 2023
Image sensor package
SAMSUNG ELECTRONICS CO LTD2 citations73
US11152416B2Oct 19, 2021
Semiconductor package including a redistribution line
SAMSUNG ELECTRONICS CO LTD2 citations73
US10971535B2Apr 6, 2021
Image sensor package
SAMSUNG ELECTRONICS CO LTD4 citations73
US10680025B2Jun 9, 2020
Semiconductor package and image sensor
SAMSUNG ELECTRONICS CO LTD4 citations73
US10750112B2Aug 18, 2020
Substrate structures for image sensor modules and image sensor modules including the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US8940557B2Jan 27, 2015
Method of fabricating wafer level package
SAMSUNG ELECTRONICS CO LTD4 citations72
US10985152B2Apr 20, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations71
US10510737B2Dec 17, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US9721926B2Aug 1, 2017
Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US9241407B2Jan 19, 2016
Tape film packages and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US12113087B2Oct 8, 2024
Image sensor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11569201B2Jan 31, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11158603B2Oct 26, 2021
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10978431B2Apr 13, 2021
Semiconductor package with connection substrate and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US10651224B2May 12, 2020
Semiconductor package including a redistribution line
SAMSUNG ELECTRONICS CO LTD1 citations62
US12191246B2Jan 7, 2025
Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal
SAMSUNG ELECTRONICS CO LTD0 citations61
US11830803B2Nov 28, 2023
Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal
SAMSUNG ELECTRONICS CO LTD0 citations61
US11600556B2Mar 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US8980689B2Mar 17, 2015
Method of fabricating semiconductor multi-chip stack packages
SAMSUNG ELECTRONICS CO LTD3 citations61
US11600608B2Mar 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11710757B2Jul 25, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US9620389B2Apr 11, 2017
Methods of fabricating tape film packages
SAMSUNG ELECTRONICS CO LTD1 citations50
US11764140B2Sep 19, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations47
US9431272B2Aug 30, 2016
Printed circuit board including through region and semiconductor package formed by using the same
SAMSUNG ELECTRONICS CO LTD0 citations35