Inventor
CHAU ELLIS
US40 patents
⚠️ This page may combine multiple inventors who share the name “CHAU ELLIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INVENSAS CORP
11 patentsUS8878353B2Nov 4, 2014
Structure for microelectronic packaging with bond elements to encapsulation surface
INVENSAS CORP137 citations99
US9502390B2Nov 22, 2016
BVA interposer
INVENSAS CORP59 citations98
US9095074B2Jul 28, 2015
Structure for microelectronic packaging with bond elements to encapsulation surface
INVENSAS CORP66 citations98
US9041227B2May 26, 2015
Package-on-package assembly with wire bond vias
INVENSAS CORP37 citations97
US8940630B2Jan 27, 2015
Method of making wire bond vias and microelectronic package having wire bond vias
INVENSAS CORP48 citations94
US10297582B2May 21, 2019
BVA interposer
INVENSAS CORP6 citations84
US9761558B2Sep 12, 2017
Package-on-package assembly with wire bond vias
INVENSAS CORP4 citations84
US9615456B2Apr 4, 2017
Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface
INVENSAS CORP3 citations73
US11189595B2Nov 30, 2021
Package-on-package assembly with wire bond vias
INVENSAS CORP0 citations62
US9252122B2Feb 2, 2016
Package-on-package assembly with wire bond vias
INVENSAS CORP2 citations62
US10756049B2Aug 25, 2020
Package-on-package assembly with wire bond vias
INVENSAS CORP0 citations52
TESSERA INC
11 patentsUS9224717B2Dec 29, 2015
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC76 citations97
US9093435B2Jul 28, 2015
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC68 citations97
US10062661B2Aug 28, 2018
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC5 citations84
US10593643B2Mar 17, 2020
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC1 citations73
US9218988B2Dec 22, 2015
Microelectronic packages and methods therefor
TESSERA INC3 citations63
US9196581B2Nov 24, 2015
Flow underfill for microelectronic packages
TESSERA INC2 citations63
US9691731B2Jun 27, 2017
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC1 citations62
US10833044B2Nov 10, 2020
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC0 citations52
US9984901B2May 29, 2018
Method for making a microelectronic assembly having conductive elements
TESSERA INC0 citations52
US9349672B2May 24, 2016
Microelectronic package
TESSERA INC0 citations52
US8981579B2Mar 17, 2015
Impedance controlled packages with metal sheet or 2-layer rdl
TESSERA INC0 citations52
HABA BELGACEM
7 patentsUS8728865B2May 20, 2014
Microelectronic packages and methods therefor
HABA BELGACEM88 citations99
US8093697B2Jan 10, 2012
Microelectronic packages and methods therefor
HABA BELGACEM117 citations99
US8058101B2Nov 15, 2011
Microelectronic packages and methods therefor
HABA BELGACEM87 citations99
US8697492B2Apr 15, 2014
No flow underfill
HABA BELGACEM36 citations94
US8222725B2Jul 17, 2012
Metal can impedance control structure
HABA BELGACEM7 citations84
US8786083B2Jul 22, 2014
Impedance controlled packages with metal sheet or 2-layer RDL
HABA BELGACEM5 citations73
US9136197B2Sep 15, 2015
Impedence controlled packages with metal sheet or 2-layer RDL
HABA BELGACEM0 citations42