P

Inventor

CHOI YUN-SEOK

KR95 patents
⚠️ This page may combine multiple inventors who share the name “CHOI YUN-SEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

22 patents
US8802495B2Aug 12, 2014

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

SAMSUNG ELECTRONICS CO LTD87 citations98
US7868462B2Jan 11, 2011

Semiconductor package including transformer or antenna

SAMSUNG ELECTRONICS CO LTD39 citations93
US11515290B2Nov 29, 2022

Semiconductor package

SAMSUNG ELECTRONICS CO LTD9 citations86
US11244904B2Feb 8, 2022

Semiconductor package including interposer

SAMSUNG ELECTRONICS CO LTD4 citations84
US10199319B2Feb 5, 2019

Printed circuit board and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD11 citations84
US7554945B2Jun 30, 2009

Apparatus and method for receiving data in a mobile communication system

SAMSUNG ELECTRONICS CO LTD10 citations84
US11081440B2Aug 3, 2021

Interposer and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD7 citations82
US11694949B2Jul 4, 2023

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD2 citations73
US11676902B2Jun 13, 2023

Semiconductor package including interposer

SAMSUNG ELECTRONICS CO LTD2 citations73
US10225495B2Mar 5, 2019

Crosstalk processing module, method of processing crosstalk and image processing system

SAMSUNG ELECTRONICS CO LTD4 citations72
US11954938B2Apr 9, 2024

Fingerprint sensor package and smart card including fingerprint sensor package

SAMSUNG ELECTRONICS CO LTD2 citations71
US11721679B2Aug 8, 2023

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations71
US11145637B2Oct 12, 2021

Semiconductor package including a substrate having two silicon layers formed on each other

SAMSUNG ELECTRONICS CO LTD4 citations71
US9892915B2Feb 13, 2018

Hard mask composition, carbon nanotube layer structure, pattern forming method, and manufacturing method of semiconductor device

SAMSUNG ELECTRONICS CO LTD3 citations69
US9999957B2Jun 19, 2018

Polishing head and polishing carrier apparatus having the same

SAMSUNG ELECTRONICS CO LTD3 citations65
US12412821B2Sep 9, 2025

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations63
US12136590B2Nov 5, 2024

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations63
US12002784B2Jun 4, 2024

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations63
US11887919B2Jan 30, 2024

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations63
US11495574B2Nov 8, 2022

Semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations63
US8847378B2Sep 30, 2014

Semiconductor package

SAMSUNG ELECTRONICS CO LTD3 citations63
US7705433B2Apr 27, 2010

Semiconductor package preventing generation of static electricity therein

SAMSUNG ELECTRONICS CO LTD3 citations63

UNIV COLORADO STATE RES FOUND

4 patents

SAMSUNG SDI CO LTD

3 patents

CHOI YUN-SEOK

3 patents

BLACKBERRY LTD

3 patents

RESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV

2 patents

KORLOY INC

2 patents

WEBER ARNETT RYAN

1 patent

YOO JAE-WOOK

1 patent

WANG QIAN

1 patent

CHO YOUNG-SANG

1 patent

RYU SEUNG KWAN

1 patent

CHOI YUN SEOK

1 patent

KWON HEUNG-KYU

1 patent

UNIV SUNGKYUNKWAN RES & BUS

1 patent

LEE SEOK HYUN

1 patent

CHUNG YE-CHUNG

1 patent

KIM YONG-HOON

1 patent

Showing the top 50 of 95 patents by PatentIndex Score.