Inventor
ZAKA ALBAN
DE29 patents
⚠️ This page may combine multiple inventors who share the name “ZAKA ALBAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
22 patentsUS9324869B1Apr 26, 2016
Method of forming a semiconductor device and resulting semiconductor devices
GLOBALFOUNDRIES INC12 citations84
US10121846B1Nov 6, 2018
Resistor structure with high resistance based on very thin semiconductor layer
GLOBALFOUNDRIES INC10 citations83
US11552192B2Jan 10, 2023
High-voltage devices integrated on semiconductor-on-insulator substrate
GLOBALFOUNDRIES INC4 citations74
US9881841B2Jan 30, 2018
Methods for fabricating integrated circuits with improved implantation processes
GLOBALFOUNDRIES INC2 citations73
US9466717B1Oct 11, 2016
Complex semiconductor devices of the SOI type
GLOBALFOUNDRIES INC6 citations73
US9905707B1Feb 27, 2018
MOS capacitive structure of reduced capacitance variability
GLOBALFOUNDRIES INC6 citations69
US8853752B2Oct 7, 2014
Performance enhancement in transistors by providing a graded embedded strain-inducing semiconductor region with adapted angles with respect to the substrate surface
GLOBALFOUNDRIES INC5 citations69
US9263270B2Feb 16, 2016
Method of forming a semiconductor device structure employing fluorine doping and according semiconductor device structure
GLOBALFOUNDRIES INC2 citations62
US10283584B2May 7, 2019
Capacitive structure in a semiconductor device having reduced capacitance variability
GLOBALFOUNDRIES INC1 citations60
US10170614B2Jan 1, 2019
Method of forming a semiconductor device
GLOBALFOUNDRIES INC1 citations60
US10580863B2Mar 3, 2020
Transistor element with reduced lateral electrical field
GLOBALFOUNDRIES INC1 citations56
US9312189B2Apr 12, 2016
Methods for fabricating integrated circuits with improved implantation processes
GLOBALFOUNDRIES INC1 citations52
US9190516B2Nov 17, 2015
Method for a uniform compressive strain layer and device thereof
GLOBALFOUNDRIES INC0 citations52
US9711513B2Jul 18, 2017
Semiconductor structure including a nonvolatile memory cell and method for the formation thereof
GLOBALFOUNDRIES INC1 citations51
US9460955B2Oct 4, 2016
Integrated circuits with shallow trench isolations, and methods for producing the same
GLOBALFOUNDRIES INC0 citations51
US10038091B2Jul 31, 2018
Semiconductor device and method
GLOBALFOUNDRIES INC0 citations50
US10283642B1May 7, 2019
Thin body field effect transistor including a counter-doped channel area and a method of forming the same
GLOBALFOUNDRIES INC0 citations49
US9396950B2Jul 19, 2016
Low thermal budget schemes in semiconductor device fabrication
GLOBALFOUNDRIES INC0 citations49
US10497803B2Dec 3, 2019
Fully depleted silicon on insulator (FDSOI) lateral double-diffused metal oxide semiconductor (LDMOS) for high frequency applications
GLOBALFOUNDRIES INC0 citations48
US10930777B2Feb 23, 2021
Laterally double diffused metal oxide semiconductor (LDMOS) device on fully depleted silicon on insulator (FDSOI) enabling high input voltage
GLOBALFOUNDRIES INC0 citations47
US9741625B2Aug 22, 2017
Method of forming a semiconductor device with STI structures on an SOI substrate
GLOBALFOUNDRIES INC0 citations41
US10644152B1May 5, 2020
Buried-channel low noise transistors and methods of making such devices
GLOBALFOUNDRIES INC0 citations39
GLOBALFOUNDRIES US INC
4 patentsUS11837605B2Dec 5, 2023
Structure including transistor using buried insulator layer as gate dielectric and trench isolations in source and drain
GLOBALFOUNDRIES US INC0 citations61
US11929433B2Mar 12, 2024
Asymmetric FET for FDSOI devices
GLOBALFOUNDRIES US INC0 citations56
US11245032B2Feb 8, 2022
Asymmetric FET for FDSOI devices
GLOBALFOUNDRIES US INC0 citations56
US12575189B2Mar 10, 2026
Silicon-controlled rectifiers with a segmented floating region
GLOBALFOUNDRIES US INC0 citations46
GLOBALFOUNDRIES DRESDEN MOD 1
3 patentsUS11315949B2Apr 26, 2022
Charge-trapping sidewall spacer-type non-volatile memory device and method
GLOBALFOUNDRIES DRESDEN MOD 12 citations67
US11984503B2May 14, 2024
High-voltage devices integrated on semiconductor-on-insulator substrate
GLOBALFOUNDRIES DRESDEN MOD 10 citations61
US11610999B2Mar 21, 2023
Floating-gate devices in high voltage applications
GLOBALFOUNDRIES DRESDEN MOD 10 citations57