Inventor

SHIMADA YUZO

JP44 patents

⚠️ This page may combine multiple inventors who share the name “SHIMADA YUZO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIMADA YUZO

NEC CORP

Semiconductor device, and thin film capacitor

Printed wiring board with integrated coil inductor

Semiconductor packing stack module and method of producing the same

Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same

Photo-electric combined substrate, optical waveguide and manufacturing process therefor

Packaged semiconductor device and method of manufacturing the same

Laminate printed circuit board with a magnetic layer

Connecting member and a connecting method with ball and tapered via

Packaged semiconductor device and method of manufacturing the same

Interconnection structures and method of making same

Semiconductor device and method of fabricating the same

Multi-layer circuit board having a large heat dissipation

Stacked carrier three-dimensional memory module and semiconductor device using the same

Multilayer ceramic substrate with interlayered capacitor

Optical waveguide board and optical module

Semiconductor device and method for packaging same

Semiconductor device packaging structure

Solder ball arrangement device

Method for arranging minute metallic balls

Supporting member for cooling means and electronic package using the same

Seal structure for tape carrier package

Process for connecting electronic devices

MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate

Optical path control apparatus with mirror section, and manufacturing method for the same

IC package and IC probe card with organic substrate

Electronic device assembly

Supporting member for cooling means, electronic package and method of making the same

Ceramic substrate having wiring of silver series

Low temperature sintering low dielectric inorganic composition

Process for manufacturing a ceramic wiring substrate having a low dielectric constant

Multilayer glass ceramic substrate and process for producing the same

Semiconductor device with decoupling capacitors mounted on conductors

Three-dimensional semiconductor device and method of manufacturing the same

Solder ball arrangement device

Fabrication method of plastic-molded lead component

Optical module and manufacturing method thereof

Multilayer glass ceramic substrate and process for producing the same

JAPAN E M CO LTD

Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip

Transfer apparatus for arraying small conductive bumps on substrate and/ or chip

NEC TOPPAN CIRCUIT SOLUTIONS

Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board

Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk

NIPPON ELECTRIC CO

Multilayer substrate including layers of an alumina and borosilicate-lead-glass ceramic material

JAPAN EM KK

Method and apparatus for lining up micro-balls

UNIV NIHON

Three-axis motion table