Inventor
SENBA NAOJI
JP22 patents
⚠️ This page may combine multiple inventors who share the name “SENBA NAOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
21 patentsUS6114864ASep 5, 2000
Probe card with plural probe tips on a unitary flexible tongue
NEC CORP152 citations99
US6307392B1Oct 23, 2001
Probe card and method of forming a probe card
NEC CORP96 citations98
US6188127B1Feb 13, 2001
Semiconductor packing stack module and method of producing the same
NEC CORP226 citations97
US5600180AFeb 4, 1997
Sealing structure for bumps on a semiconductor integrated circuit chip
NEC CORP129 citations97
US5793117AAug 11, 1998
Semiconductor device and method of fabricating the same
NEC CORP58 citations96
US5973392AOct 26, 1999
Stacked carrier three-dimensional memory module and semiconductor device using the same
NEC CORP154 citations95
US5883426AMar 16, 1999
Stack module
NEC CORP410 citations94
US6798070B2Sep 28, 2004
Electronic device assembly and a method of connecting electronic devices constituting the same
NEC CORP23 citations92
US6576499B2Jun 10, 2003
Electronic device assembly and a method of connecting electronic devices constituting the same
NEC CORP25 citations92
US6307159B1Oct 23, 2001
Bump structure and method for making the same
NEC CORP32 citations92
US6095398AAug 1, 2000
Solder ball arrangement device
NEC CORP25 citations92
US5976965ANov 2, 1999
Method for arranging minute metallic balls
NEC CORP35 citations92
US5310965AMay 10, 1994
Multi-level wiring structure having an organic interlayer insulating film
NEC CORP39 citations92
US6313533B1Nov 6, 2001
Function element, substrate for mounting function element thereon, and method of connecting them to each other
NEC CORP22 citations91
US5936845AAug 10, 1999
IC package and IC probe card with organic substrate
NEC CORP13 citations74
US6625883B2Sep 30, 2003
Method for making a bump structure
NEC CORP2 citations63
US6486540B2Nov 26, 2002
Three-dimensional semiconductor device and method of manufacturing the same
NEC CORP6 citations63
US6378756B1Apr 30, 2002
Solder ball arrangement device
NEC CORP3 citations63
US6191482B1Feb 20, 2001
Semiconductor chip carrier having partially buried conductive pattern and semiconductor device using the same
NEC CORP6 citations63
US6096259AAug 1, 2000
Fabrication method of plastic-molded lead component
NEC CORP6 citations63
US6194787B1Feb 27, 2001
Multistage coupling semiconductor carrier, semiconductor device using the semiconductor carrier
NEC CORP2 citations62