Inventor

WU LIQI

US25 patents

⚠️ This page may combine multiple inventors who share the name “WU LIQI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WU LIQI

APPLIED MATERIALS INC

Selective etch of metal nitride films

Low thickness dependent work-function nMOS integration for metal gate

Multi-threshold voltage structures with a lanthanum nitride film and methods of formation thereof

Methods for forming metal organic tungsten for middle of the line (MOL) applications

Selective deposition defects removal by chemical etch

Methods for selective deposition using self-assembled monolayers

Wafer treatment for achieving defect-free self-assembled monolayers

Methods for enhancing selectivity in SAM-based selective deposition

Methods and apparatus for cryogenic gas stream assisted SAM-based selective deposition

Method for forming a layer

Methods for enhancing selectivity in SAM-based selective deposition

Wafer treatment for achieving defect-free self-assembled monolayers

Methods of selective atomic layer deposition

Methods of selective atomic layer deposition

Methods and apparatus for n-type metal oxide semiconductor (NMOS) metal gate materials using atomic layer deposition (ALD) processes with metal based precursors

Selective metal removal with flowable polymer

Dual silicide process using ruthenium silicide

Selective aluminum oxide film deposition

Gap fill methods using catalyzed deposition

Methods for forming low resistivity contacts

Method of forming a MEOL contact structure

Methods and apparatus for high reflectivity aluminum layers

ZHOU CHUNMING

High density plasma etchback process for advanced metallization applications

NOVELLUS SYSTEMS INC

Continuous plasma and RF bias to regulate damage in a substrate processing system

APPLIED MAT INC

Flexible monomer for smooth polymer surface