Inventor
HUSSAIN MOHAMMAD WASEEM
US6 patents
Patents
6 patentsUS11538741B2Dec 27, 2022
Multi-chip module leadless package
TEXAS INSTRUMENTS INC2 citations68
US12142550B2Nov 12, 2024
Multi-chip module leadless package
TEXAS INSTRUMENTS INC1 citations58
US11410913B2Aug 9, 2022
Multi-layer die attachment
TEXAS INSTRUMENTS INC0 citations58
US11569154B2Jan 31, 2023
Interdigitated outward and inward bent leads for packaged electronic device
TEXAS INSTRUMENTS INC0 citations49
US10636727B2Apr 28, 2020
Multi-layer die attachment
TEXAS INSTRUMENTS INC0 citations48
US11855001B2Dec 26, 2023
Leadless leadframe and semiconductor device package therefrom
TEXAS INSTRUMENTS INC0 citations47