Inventor
ROBINSON KARL M
US103 patents
Patents
50 patentsUS6361417B2Mar 26, 2002
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
MICRON TECHNOLOGY INC141 citations99
US6331139B2Dec 18, 2001
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
MICRON TECHNOLOGY INC95 citations99
US6273800B1Aug 14, 2001
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
MICRON TECHNOLOGY INC133 citations99
US6203407B1Mar 20, 2001
Method and apparatus for increasing-chemical-polishing selectivity
MICRON TECHNOLOGY INC153 citations99
US6191037B1Feb 20, 2001
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
MICRON TECHNOLOGY INC185 citations99
US6143123ANov 7, 2000
Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
MICRON TECHNOLOGY INC139 citations99
US6046111AApr 4, 2000
Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates
MICRON TECHNOLOGY INC162 citations99
US5990012ANov 23, 1999
Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads
MICRON TECHNOLOGY INC114 citations99
US5981396ANov 9, 1999
Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
MICRON TECHNOLOGY INC139 citations99
US5919082AJul 6, 1999
Fixed abrasive polishing pad
MICRON TECHNOLOGY INC118 citations99
US5893754AApr 13, 1999
Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
MICRON TECHNOLOGY INC188 citations99
US5879226AMar 9, 1999
Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
MICRON TECHNOLOGY INC150 citations99
US5879222AMar 9, 1999
Abrasive polishing pad with covalently bonded abrasive particles
MICRON TECHNOLOGY INC130 citations99
US5868896AFeb 9, 1999
Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
MICRON TECHNOLOGY INC236 citations99
US5830806ANov 3, 1998
Wafer backing member for mechanical and chemical-mechanical planarization of substrates
MICRON TECHNOLOGY INC157 citations99
US5779522AJul 14, 1998
Directional spray pad scrubber
MICRON TECHNOLOGY INC125 citations99
US5733176AMar 31, 1998
Polishing pad and method of use
MICRON TECHNOLOGY INC185 citations99
US5725417AMar 10, 1998
Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
MICRON TECHNOLOGY INC234 citations99
US5624303AApr 29, 1997
Polishing pad and a method for making a polishing pad with covalently bonded particles
MICRON TECHNOLOGY INC240 citations99
US5616069AApr 1, 1997
Directional spray pad scrubber
MICRON TECHNOLOGY INC195 citations99
US7276446B2Oct 2, 2007
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
MICRON TECHNOLOGY INC63 citations98
US6402884B1Jun 11, 2002
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
MICRON TECHNOLOGY INC94 citations98
US6325702B2Dec 4, 2001
Method and apparatus for increasing chemical-mechanical-polishing selectivity
MICRON TECHNOLOGY INC85 citations98
US6238270B1May 29, 2001
Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
MICRON TECHNOLOGY INC97 citations98
US6174780B1Jan 16, 2001
Method of preparing integrated circuit devices containing isolated dielectric material
MICRON TECHNOLOGY INC91 citations98
US6090475AJul 18, 2000
Polishing pad, methods of manufacturing and use
MICRON TECHNOLOGY INC139 citations98
US6060395AMay 9, 2000
Planarization method using a slurry including a dispersant
MICRON TECHNOLOGY INC98 citations98
US5938801AAug 17, 1999
Polishing pad and a method for making a polishing pad with covalently bonded particles
MICRON TECHNOLOGY INC138 citations98
US5882248AMar 16, 1999
Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
MICRON TECHNOLOGY INC193 citations98
US5658190AAug 19, 1997
Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
MICRON TECHNOLOGY INC179 citations98
US6254460B1Jul 3, 2001
Fixed abrasive polishing pad
MICRON TECHNOLOGY INC65 citations97
US6136043AOct 24, 2000
Polishing pad methods of manufacture and use
MICRON TECHNOLOGY INC107 citations97
US5792709AAug 11, 1998
High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers
MICRON TECHNOLOGY INC185 citations97
US6455916B1Sep 24, 2002
Integrated circuit devices containing isolated dielectric material
MICRON TECHNOLOGY INC53 citations96
US6409586B2Jun 25, 2002
Fixed abrasive polishing pad
MICRON TECHNOLOGY INC45 citations96
US6290579B1Sep 18, 2001
Fixed abrasive polishing pad
MICRON TECHNOLOGY INC34 citations96
US6277015B1Aug 21, 2001
Polishing pad and system
MICRON TECHNOLOGY INC52 citations96
US6224466B1May 1, 2001
Methods of polishing materials, methods of slowing a rate of material removal of a polishing process
MICRON TECHNOLOGY INC66 citations96
US5834358ANov 10, 1998
Isolation regions and methods of forming isolation regions
MICRON TECHNOLOGY INC71 citations96
US5827781AOct 27, 1998
Planarization slurry including a dispersant and method of using same
MICRON TECHNOLOGY INC82 citations96
US5823855AOct 20, 1998
Polishing pad and a method for making a polishing pad with covalently bonded particles
MICRON TECHNOLOGY INC86 citations96
US5645737AJul 8, 1997
Wet clean for a surface having an exposed silicon/silica interface
MICRON TECHNOLOGY INC54 citations96
US6124207ASep 26, 2000
Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurries
MICRON TECHNOLOGY INC94 citations95
US6995072B2Feb 7, 2006
Method of making sacrificial self-aligned interconnection structure
MICRON TECHNOLOGY INC13 citations93
US6532772B1Mar 18, 2003
Formation of planar dielectric layers using liquid interfaces
MICRON TECHNOLOGY INC27 citations93
US6521536B1Feb 18, 2003
Planarization process
MICRON TECHNOLOGY INC27 citations93
US6409936B1Jun 25, 2002
Composition and method of formation and use therefor in chemical-mechanical polishing
MICRON TECHNOLOGY INC22 citations93
US6143627ANov 7, 2000
Method for electrochemical oxidation of silicon
MICRON TECHNOLOGY INC24 citations93
US6103638AAug 15, 2000
Formation of planar dielectric layers using liquid interfaces
MICRON TECHNOLOGY INC26 citations93
US6096650AAug 1, 2000
Treatment of a surface having exposed silica
MICRON TECHNOLOGY INC16 citations93
Showing the top 50 of 103 patents by PatentIndex Score.