Inventor · disambiguated record
Stanley Wang
Also filed as: WANG STANLEY · WANG STANLEY J · WANG STANLEY JONATHAN
17 granted patents·6 pending applications·831 citations·filing 1996–2023
92Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO14WI LAN INC3STANWOOD KENNETH L2HEWLETT PACKARD CO1THOMSON NEWSPAPERS INC1
Top patents by PatentIndex Score
23 records- 0194US8311040B2Packing source data packets into transporting packets with fragmentationSTANWOOD KENNETH L·Filed 2010·Granted Nov 13, 2012·13 cites·22 claims
- 0290US7203111B2Method and apparatus for driver circuit in a MEMS deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Apr 10, 2007·30 cites·17 claims
- 0389US11787180B2Corrosion tolerant micro-electromechanical fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Oct 17, 2023·2 cites·15 claims
- 0487US6253188B1Automated interactive classified ad system for the internetTHOMSON NEWSPAPERS INC·Filed 1996·Granted Jun 26, 2001·764 cites·30 claims
- 0585US9374733B2Packing source data packets into transporting packets with fragmentationWI LAN INC·Filed 2015·Granted Jun 21, 2016·3 cites·30 claims
- 0682US12491716B2Corrosion tolerant micro-electromechanical fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Dec 9, 2025·0 cites·15 claims
- 0773US6800497B2Power switching transistor and method of manufacture for a fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Oct 5, 2004·15 cites·17 claims
- 0872US11197290B2Packing source data packets into transporting packets with fragmentationWI LAN INC·Filed 2020·Granted Dec 7, 2021·0 cites·11 claims
- 0970US10675867B2Thermal inkjet resistor circuitHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jun 9, 2020·0 cites·13 claims
- 1060US10272671B2Isolating failed resistorsHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Apr 30, 2019·0 cites·13 claims
- 1158US10772086B2Packing source data packets into transporting packets with fragmentationWI LAN INC·Filed 2016·Granted Sep 8, 2020·0 cites·2 claims
- 1255US11395062B2Adjustable sensorsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jul 19, 2022·0 cites·14 claims
- 1355US8009667B1Packing source data packets into transporting packets with fragmentationWI & MDASH LAN INC·Filed 2002·Granted Aug 30, 2011·4 cites·36 claims
- 1453US11155085B2Thermal fluid ejection heating elementHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Oct 26, 2021·0 cites·20 claims
- 1552US9119095B2Packing source data packets into transporting packets with fragmentationSTANWOOD KENNETH L·Filed 2010·Granted Aug 25, 2015·0 cites·21 claims
- 1652US2008208712A1Computer based systems to conduct sales of products or services over a communication networkYERKES PHIL·Filed 2007·Application pending·0 cites
- 1745US2022048763A1Manufacturing a corrosion tolerant micro-electromechanical fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1845US2022118763A1Fluid feed holeHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1944US11425492B2Angle modification of audio output devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Aug 23, 2022·0 cites·13 claims
- 2042US2022177296A1Epitaxial-silicon wafer with a buried oxide layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 2141US2004212026A1MEMS device having time-varying controlHEWLETT PACKARD CO·Filed 2004·Application pending·0 cites
- 2238US7486588B2Method and apparatus for driver circuit to provide a desired voltage level to a deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Feb 3, 2009·0 cites·20 claims
- 2338US2008100534A1SwitchHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Application pending·0 cites
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