Inventor
WADA SHOJI
US22 patents
⚠️ This page may combine multiple inventors who share the name “WADA SHOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
8 patentsUS5946245AAug 31, 1999
Memory array test circuit and method
TEXAS INSTRUMENTS INC27 citations92
US5831925ANov 3, 1998
Memory configuration circuit and method
TEXAS INSTRUMENTS INC38 citations91
US9443737B2Sep 13, 2016
Method of forming metal contacts in the barrier layer of a group III-N HEMT
TEXAS INSTRUMENTS INC8 citations84
US10374057B2Aug 6, 2019
Method of forming metal contacts in the barrier layer of a group III-N HEMT
TEXAS INSTRUMENTS INC1 citations73
US9818839B2Nov 14, 2017
Method of forming metal contacts in the barrier layer of a group III-N HEMT
TEXAS INSTRUMENTS INC3 citations73
US6166977ADec 26, 2000
Address controlled sense amplifier overdrive timing for semiconductor memory device
TEXAS INSTRUMENTS INC13 citations71
US10707323B2Jul 7, 2020
Method of forming metal contacts in the barrier layer of a group III-N HEMT
TEXAS INSTRUMENTS INC0 citations52
US11978790B2May 7, 2024
Normally-on gallium nitride based transistor with p-type gate
TEXAS INSTRUMENTS INC0 citations51
HITACHI LTD
6 patentsUS5150325ASep 22, 1992
Bi-CMOS semiconductor memory device, including improved layout structure and testing method
HITACHI LTD45 citations95
US5276648AJan 4, 1994
Testing method for a semiconductor memory device
HITACHI LTD21 citations92
US5598373AJan 28, 1997
Semiconductor memory system
HITACHI LTD29 citations91
US6084809AJul 4, 2000
Main amplifier circuit and input-output bus for a dynamic random access memory
HITACHI LTD9 citations73
US5506804AApr 9, 1996
Dynamic Random Access Type Semiconductor Device
HITACHI LTD9 citations73
US5304868AApr 19, 1994
Non-inverting buffer circuit device and semiconductor memory circuit device
HITACHI LTD3 citations63
SHINKAWA KK
5 patentsUS9679866B2Jun 13, 2017
Bonding stage and method of manufacturing the same
SHINKAWA KK2 citations73
US11508688B2Nov 22, 2022
Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips
SHINKAWA KK2 citations72
US11521890B2Dec 6, 2022
Apparatus for manufacturing semiconductor device
SHINKAWA KK0 citations62
US11562916B2Jan 24, 2023
Mounting apparatus and temperature measurement method
SHINKAWA KK0 citations52
US10137519B2Nov 27, 2018
Flux reservoir apparatus
SHINKAWA KK0 citations41