Inventor
KHOO POH BOON
MY9 patents
Patents
9 patentsUS10998262B2May 4, 2021
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
INTEL CORP1 citations72
US11205613B2Dec 21, 2021
Organic mold interconnects in shielded interconnects frames for integrated-circuit packages
INTEL CORP2 citations71
US12400952B2Aug 26, 2025
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
INTEL CORP0 citations62
US11908793B2Feb 20, 2024
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
INTEL CORP0 citations62
US11658111B2May 23, 2023
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
INTEL CORP0 citations62
US12575448B2Mar 10, 2026
Integrated circuit packages with on package memory architectures
INTEL CORP0 citations61
US11699644B2Jul 11, 2023
Organic mold interconnects in shielded interconnects frames for integrated-circuit packages
INTEL CORP0 citations61
US12588511B2Mar 24, 2026
Shielding assembly for semiconductor packages
INTEL CORP0 citations51
US11322434B2May 3, 2022
Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages
INTEL CORP0 citations50