Inventor

LIN WEI-TENG

TW2 patents

⚠️ This page may combine multiple inventors who share the name “LIN WEI-TENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIPBOND TECHNOLOGY CORP

1 patent

US12464639B2Nov 4, 2025

Semiconductor package having flow-guiding grooves and circuit board thereof

CHIPBOND TECHNOLOGY CORP0 citations41

LIN WEI-TENG

1 patent

US8754933B2Jun 17, 2014

Miniature photographic apparatus

LIN WEI-TENG0 citations17