Inventor
HARVILCHUCK JOSEPH M
US10 patents
⚠️ This page may combine multiple inventors who share the name “HARVILCHUCK JOSEPH M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS5052481AOct 1, 1991
High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
IBM131 citations97
US5130067AJul 14, 1992
Method and means for co-sintering ceramic/metal mlc substrates
IBM140 citations96
US3994793ANov 30, 1976
Reactive ion etching of aluminum
IBM86 citations93
US5543584AAug 6, 1996
Structure for repairing electrical lines
IBM21 citations92
US5153408AOct 6, 1992
Method and structure for repairing electrical lines
IBM33 citations92
US4634638AJan 6, 1987
High melting point copper-gold-tin brazing alloy for chip carriers
IBM19 citations79
US4962294AOct 9, 1990
Method and apparatus for causing an open circuit in a conductive line
IBM17 citations71
US4601424AJul 22, 1986
Stripped gold plating process
IBM9 citations64
(unassigned)
2 patentsUS5565235AOct 15, 1996
Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate
12 citations69
US5403650AApr 4, 1995
Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby
12 citations69