Inventor
PALMATEER PAUL H
US7 patents
Patents
7 patentsUS4970570ANov 13, 1990
Use of tapered head pin design to improve the stress distribution in the braze joint
IBM34 citations92
US4418857ADec 6, 1983
High melting point process for Au:Sn:80:20 brazing alloy for chip carriers
IBM113 citations92
US4880684ANov 14, 1989
Sealing and stress relief layers and use thereof
IBM83 citations91
US4764341AAug 16, 1988
Bonding of pure metal films to ceramics
IBM22 citations81
US4634638AJan 6, 1987
High melting point copper-gold-tin brazing alloy for chip carriers
IBM19 citations79
US4824009AApr 25, 1989
Process for braze attachment of electronic package members
IBM11 citations71
US5167913ADec 1, 1992
Method of forming an adherent layer of metallurgy on a ceramic substrate
IBM6 citations62