Inventor · disambiguated record
Constantine A. Neugebauer
Also filed as: NEUGEBAUER CONSTANTIN · NEUGEBAUER CONSTANTINE A
31 granted patents·1,890 citations·filing 1975–1993
98Inventor score
Top patents by PatentIndex Score
31 records- 0197US5366906AWafer level integration and testingMARTIN MARIETTA CORP·Filed 1992·Granted Nov 22, 1994·196 cites·13 claims
- 0294US4750666AMethod of fabricating gold bumps on IC's and power chipsGEN ELECTRIC·Filed 1986·Granted Jun 14, 1988·133 cites·17 claims
- 0393US3993411ABonds between metal and a non-metallic substrateGEN ELECTRIC·Filed 1975·Granted Nov 23, 1976·103 cites·6 claims
- 0491US5291066AMoisture-proof electrical circuit high density interconnect module and method for making sameGEN ELECTRIC·Filed 1991·Granted Mar 1, 1994·154 cites·15 claims
- 0591US4901136AMulti-chip interconnection packageGEN ELECTRIC·Filed 1988·Granted Feb 13, 1990·99 cites·15 claims
- 0691US4803450AMultilayer circuit board fabricated from siliconGEN ELECTRIC·Filed 1987·Granted Feb 7, 1989·73 cites·19 claims
- 0791US4774632AHybrid integrated circuit chip packageGEN ELECTRIC·Filed 1987·Granted Sep 27, 1988·98 cites·12 claims
- 0890US5336928AHermetically sealed packaged electronic systemGEN ELECTRIC·Filed 1992·Granted Aug 9, 1994·118 cites·9 claims
- 0989US4646129AHermetic power chip packagesGEN ELECTRIC·Filed 1986·Granted Feb 24, 1987·87 cites·11 claims
- 1088US4996116AEnhanced direct bond structureGEN ELECTRIC·Filed 1989·Granted Feb 26, 1991·50 cites·49 claims
- 1187US4103274AReconstituted metal oxide varistorGEN ELECTRIC·Filed 1976·Granted Jul 25, 1978·29 cites·25 claims
- 1286US5384691AHigh density interconnect multi-chip modules including embedded distributed power supply elementsGEN ELECTRIC·Filed 1993·Granted Jan 24, 1995·98 cites·7 claims
- 1383US5103290AHermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chipGEN ELECTRIC·Filed 1989·Granted Apr 7, 1992·62 cites·42 claims
- 1480US5028987AHigh current hermetic package having a lead extending through the package lid and a packaged semiconductor chipGEN ELECTRIC·Filed 1989·Granted Jul 2, 1991·52 cites·25 claims
- 1579US5166773AHermetic package and packaged semiconductor chip having closely spaced leads extending through the package lidGEN ELECTRIC·Filed 1989·Granted Nov 24, 1992·50 cites·15 claims
- 1678US5418002ADirect bonding of copper to aluminum nitride substratesHARRIS CORP·Filed 1990·Granted May 23, 1995·29 cites·22 claims
- 1778US5100740ADirect bonded symmetric-metallic-laminate/substrate structuresGEN ELECTRIC·Filed 1991·Granted Mar 31, 1992·35 cites·25 claims
- 1876US5043859AHalf bridge device package, packaged devices and circuitsGEN ELECTRIC·Filed 1989·Granted Aug 27, 1991·47 cites·23 claims
- 1975US5293070AIntegrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modulesGEN ELECTRIC·Filed 1992·Granted Mar 8, 1994·59 cites·3 claims
- 2075US5105536AMethod of packaging a semiconductor chip in a low inductance packageGEN ELECTRIC·Filed 1991·Granted Apr 21, 1992·51 cites·4 claims
- 2174US5139972ABatch assembly of high density hermetic packages for power semiconductor chipsGEN ELECTRIC·Filed 1991·Granted Aug 18, 1992·54 cites·8 claims
- 2274US5135890AMethod of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chipGEN ELECTRIC·Filed 1991·Granted Aug 4, 1992·49 cites·6 claims
- 2367US4769744ASemiconductor chip packages having solder layers of enhanced durabilityGEN ELECTRIC·Filed 1986·Granted Sep 6, 1988·33 cites·18 claims
- 2461US5018002AHigh current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chipGEN ELECTRIC·Filed 1989·Granted May 21, 1991·25 cites·27 claims
- 2556US5206186AMethod for forming semiconductor electrical contacts using metal foil and thermocompression bondingGEN ELECTRIC·Filed 1992·Granted Apr 27, 1993·24 cites·7 claims
- 2653US4816422AFabrication of large power semiconductor composite by wafer interconnection of individual devicesGEN ELECTRIC·Filed 1986·Granted Mar 28, 1989·18 cites·21 claims
- 2751US5209390AHermetic package and packaged semiconductor chip having closely spaced leads extending through the package lidGEN ELECTRIC·Filed 1992·Granted May 11, 1993·18 cites·5 claims
- 2849US4574299AThyristor packaging systemGEN ELECTRIC·Filed 1983·Granted Mar 4, 1986·13 cites·19 claims
- 2946US4745455ASilicon packages for power semiconductor devicesGEN ELECTRIC·Filed 1986·Granted May 17, 1988·16 cites·45 claims
- 3041US5184206ADirect thermocompression bonding for thin electronic power chipsGEN ELECTRIC·Filed 1990·Granted Feb 2, 1993·12 cites·9 claims
- 3134US5304847ADirect thermocompression bonding for thin electronic power chipsGEN ELECTRIC·Filed 1993·Granted Apr 19, 1994·5 cites·3 claims
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