Inventor
GLASCOCK II HOMER H
US28 patents
⚠️ This page may combine multiple inventors who share the name “GLASCOCK II HOMER H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GEN ELECTRIC
25 patentsUS5103290AApr 7, 1992
Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
GEN ELECTRIC62 citations96
US5028987AJul 2, 1991
High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip
GEN ELECTRIC52 citations96
US4939101AJul 3, 1990
Method of making direct bonded wafers having a void free interface
GEN ELECTRIC67 citations96
US4901136AFeb 13, 1990
Multi-chip interconnection package
GEN ELECTRIC99 citations96
US4803450AFeb 7, 1989
Multilayer circuit board fabricated from silicon
GEN ELECTRIC73 citations96
US4392153AJul 5, 1983
Cooled semiconductor power module including structured strain buffers without dry interfaces
GEN ELECTRIC87 citations96
US4361717ANov 30, 1982
Fluid cooled solar powered photovoltaic cell
GEN ELECTRIC117 citations96
US4541035ASep 10, 1985
Low loss, multilevel silicon circuit board
GEN ELECTRIC57 citations95
US5166773ANov 24, 1992
Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
GEN ELECTRIC50 citations92
US5135890AAug 4, 1992
Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
GEN ELECTRIC49 citations92
US5105536AApr 21, 1992
Method of packaging a semiconductor chip in a low inductance package
GEN ELECTRIC51 citations92
US5100740AMar 31, 1992
Direct bonded symmetric-metallic-laminate/substrate structures
GEN ELECTRIC35 citations92
US4921415AMay 1, 1990
Cure monitoring apparatus having high temperature ultrasonic transducers
GEN ELECTRIC54 citations92
US4825117AApr 25, 1989
Temperature compensated piezoelectric transducer assembly
GEN ELECTRIC37 citations92
US4444352AApr 24, 1984
Method of thermo-compression diffusion bonding together metal surfaces
GEN ELECTRIC31 citations92
US4366713AJan 4, 1983
Ultrasonic bond testing of semiconductor devices
GEN ELECTRIC46 citations92
US5206186AApr 27, 1993
Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding
GEN ELECTRIC24 citations91
US5209390AMay 11, 1993
Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
GEN ELECTRIC18 citations74
US4574299AMar 4, 1986
Thyristor packaging system
GEN ELECTRIC13 citations74
US4828597AMay 9, 1989
Flexible glass fiber mat bonding method
GEN ELECTRIC19 citations73
US5304847AApr 19, 1994
Direct thermocompression bonding for thin electronic power chips
GEN ELECTRIC5 citations72
US5184206AFeb 2, 1993
Direct thermocompression bonding for thin electronic power chips
GEN ELECTRIC12 citations69
US4745455AMay 17, 1988
Silicon packages for power semiconductor devices
GEN ELECTRIC16 citations69
US5133795AJul 28, 1992
Method of making a silicon package for a power semiconductor device
GEN ELECTRIC6 citations63
US5034044AJul 23, 1991
Method of bonding a silicon package for a power semiconductor device
GEN ELECTRIC6 citations63