Inventor
SETO PING KWONG
US6 patents
Patents
6 patentsUS5744863AApr 28, 1998
Chip carrier modules with heat sinks attached by flexible-epoxy
IBM243 citations97
US5672548ASep 30, 1997
Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy
IBM191 citations97
US5785799AJul 28, 1998
Apparatus for attaching heat sinks directly to chip carrier modules using flexible epoxy
IBM65 citations94
US6545229B1Apr 8, 2003
Method for producing circuit board assemblies using surface mount components with finely spaced leads
IBM20 citations90
US5742483AApr 21, 1998
Method for producing circuit board assemblies using surface mount components with finely spaced leads
IBM17 citations90
US6167615B1Jan 2, 2001
Method for producing circuit board assemblies using surface mount components with finely spaced leads
IBM7 citations71