Inventor
OTAKE KOKI
JP12 patents
⚠️ This page may combine multiple inventors who share the name “OTAKE KOKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
10 patentsUS5920117AJul 6, 1999
Semiconductor device and method of forming the device
FUJITSU LTD135 citations98
US5643831AJul 1, 1997
Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device
FUJITSU LTD231 citations98
US6025258AFeb 15, 2000
Method for fabricating solder bumps by forming solder balls with a solder ball forming member
FUJITSU LTD94 citations97
US6271110B1Aug 7, 2001
Bump-forming method using two plates and electronic device
FUJITSU LTD54 citations96
US6319810B1Nov 20, 2001
Method for forming solder bumps
FUJITSU LTD55 citations95
US6732911B2May 11, 2004
Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system
FUJITSU LTD35 citations92
US6528346B2Mar 4, 2003
Bump-forming method using two plates and electronic device
FUJITSU LTD24 citations92
US6090301AJul 18, 2000
Method for fabricating bump forming plate member
FUJITSU LTD37 citations92
US6022759AFeb 8, 2000
Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit
FUJITSU LTD31 citations92
US5747874AMay 5, 1998
Semiconductor device, base member for semiconductor device and semiconductor device unit
FUJITSU LTD37 citations92