P

Inventor

PARKHE VIJAY

US24 patents
⚠️ This page may combine multiple inventors who share the name “PARKHE VIJAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

23 patents
US6125789AOct 3, 2000

Increasing the sensitivity of an in-situ particle monitor

APPLIED MATERIALS INC564 citations99
US6503368B1Jan 7, 2003

Substrate support having bonded sections and method

APPLIED MATERIALS INC76 citations98
US6475902B1Nov 5, 2002

Chemical vapor deposition of niobium barriers for copper metallization

APPLIED MATERIALS INC380 citations98
US5903428AMay 11, 1999

Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same

APPLIED MATERIALS INC300 citations98
US6246567B1Jun 12, 2001

Apparatus for igniting a plasma in a plasma processing chamber

APPLIED MATERIALS INC50 citations96
US6190037B1Feb 20, 2001

Non-intrusive, on-the-fly (OTF) temperature measurement and monitoring system

APPLIED MATERIALS INC455 citations96
US6117246ASep 12, 2000

Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck

APPLIED MATERIALS INC50 citations96
US6033482AMar 7, 2000

Method for igniting a plasma in a plasma processing chamber

APPLIED MATERIALS INC69 citations96
US5748435AMay 5, 1998

Apparatus for controlling backside gas pressure beneath a semiconductor wafer

APPLIED MATERIALS INC87 citations96
US5691876ANov 25, 1997

High temperature polyimide electrostatic chuck

APPLIED MATERIALS INC74 citations96
US6217655B1Apr 17, 2001

Stand-off pad for supporting a wafer on a substrate support chuck

APPLIED MATERIALS INC23 citations93
US6057244AMay 2, 2000

Method for improved sputter etch processing

APPLIED MATERIALS INC68 citations93
US5909355AJun 1, 1999

Ceramic electrostatic chuck and method of fabricating same

APPLIED MATERIALS INC28 citations92
US5908334AJun 1, 1999

Electrical connector for power transmission in an electrostatic chuck

APPLIED MATERIALS INC41 citations92
US5861086AJan 19, 1999

Method and apparatus for sputter etch conditioning a ceramic body

APPLIED MATERIALS INC35 citations91
US10079165B2Sep 18, 2018

Electrostatic chuck with independent zone cooling and reduced crosstalk

APPLIED MATERIALS INC6 citations84
US6547934B2Apr 15, 2003

Reduction of metal oxide in a dual frequency etch chamber

APPLIED MATERIALS INC9 citations74
US12061103B2Aug 13, 2024

Packaging design for a flow sensor and methods of manufacturing thereof

APPLIED MATERIALS INC3 citations72
US9668373B2May 30, 2017

Substrate support chuck cooling for deposition chamber

APPLIED MATERIALS INC4 citations68
US12553751B2Feb 17, 2026

Sensor assembly and methods of manufacturing thereof

APPLIED MATERIALS INC0 citations62
US6395157B2May 28, 2002

Method and apparatus for sputter etch conditioning a ceramic body

APPLIED MATERIALS INC4 citations61
US10622229B2Apr 14, 2020

Electrostatic chuck with independent zone cooling and reduced crosstalk

APPLIED MATERIALS INC0 citations52
US9865489B2Jan 9, 2018

Substrate support chuck cooling for deposition chamber

APPLIED MATERIALS INC0 citations48

(unassigned)

1 patent