Inventor · disambiguated record
Grady S. Waldo
Also filed as: WALDO GRADY · WALDO GRADY S
13 granted patents·2 pending applications·484 citations·filing 2003–2024
92Inventor score
Top patents by PatentIndex Score
15 records- 0198US7521378B2Low temperature process for polysilazane oxidation/densificationMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 21, 2009·173 cites·84 claims
- 0298US7030034B2Methods of etching silicon nitride substantially selectively relative to an oxide of aluminumMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 18, 2006·234 cites·53 claims
- 0395US7557420B2Low temperature process for polysilazane oxidation/densificationMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 7, 2009·25 cites·45 claims
- 0492US8575040B2Low temperature process for polysilazane oxidation/densificationFUCSKO JANOS·Filed 2009·Granted Nov 5, 2013·18 cites·29 claims
- 0589US7316981B2Method of removing silicon from a substrateMICRON TECHNOLOGY INC·Filed 2006·Granted Jan 8, 2008·10 cites·21 claims
- 0680US2025113487A1Integrated Circuitry Comprising A Memory Array Comprising Strings Of Memory Cells And Method Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0779US7166539B2Wet etching method of removing silicon from a substrateMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 23, 2007·16 cites·52 claims
- 0870US7491650B2Etch compositions and methods of processing a substrateMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 17, 2009·3 cites·17 claims
- 0970US7135381B2Wet etching method of removing silicon from a substrate and method of forming trench isolationMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 14, 2006·2 cites·31 claims
- 1064US12200929B2Integrated circuitry comprising a memory array comprising strings of memory cells and method used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 14, 2025·0 cites·25 claims
- 1163US7205245B2Method of forming trench isolation within a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 17, 2007·2 cites·27 claims
- 1262US7629266B2Etch compositions and methods of processing a substrateMICRON TECHNOLOGY INC·Filed 2007·Granted Dec 8, 2009·1 cites·15 claims
- 1362US2024355595A1Low parameter plasma ashing techniquesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1454US7811897B2Method of forming trench isolationMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 12, 2010·0 cites·37 claims
- 1547US7699998B2Method of substantially uniformly etching non-homogeneous substratesMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 20, 2010·0 cites·11 claims
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