P

Inventor

KIM WOO-SIK

KR37 patents
⚠️ This page may combine multiple inventors who share the name “KIM WOO-SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

15 patents
US6727130B2Apr 27, 2004

Method of forming a CMOS type semiconductor device having dual gates

SAMSUNG ELECTRONICS CO LTD68 citations96
US6239022B1May 29, 2001

Method of fabricating a contact in a semiconductor device

SAMSUNG ELECTRONICS CO LTD53 citations96
US6635921B2Oct 21, 2003

Semiconductor memory device having a multiple tunnel junction layer pattern and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD24 citations92
US6437411B1Aug 20, 2002

Semiconductor device having chamfered silicide layer and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD31 citations91
US6095405AAug 1, 2000

Method for soldering integrated circuits

SAMSUNG ELECTRONICS CO LTD35 citations90
US6049656AApr 11, 2000

Method of mounting an integrated circuit on a printed circuit board

SAMSUNG ELECTRONICS CO LTD29 citations88
US7397095B2Jul 8, 2008

Semiconductor device having a dual gate electrode and methods of forming the same

SAMSUNG ELECTRONICS CO LTD17 citations84
US6707089B2Mar 16, 2004

Semiconductor memory device having a multiple tunnel junction pattern and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD14 citations84
US6998306B2Feb 14, 2006

Semiconductor memory device having a multiple tunnel junction pattern and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD7 citations74
US6740550B2May 25, 2004

Methods of manufacturing semiconductor devices having chamfered silicide layers therein

SAMSUNG ELECTRONICS CO LTD12 citations72
US6138892AOct 31, 2000

Method for mounting an integrated circuit from a tape carrier package on a printed circuit board

SAMSUNG ELECTRONICS CO LTD12 citations68
US6686240B2Feb 3, 2004

Semiconductor memory device having a multiple tunnel junction layer pattern and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD5 citations63
US6284996B1Sep 4, 2001

Method for mounting integrated circuits on printed circuit boards

SAMSUNG ELECTRONICS CO LTD2 citations60
US7771021B2Aug 10, 2010

Inkjet head assembly and printing apparatus with ultraviolet emitting unit and method using the same

SAMSUNG ELECTRONICS CO LTD1 citations52
US7888772B2Feb 15, 2011

Electronic fuse having heat spreading structure

SAMSUNG ELECTRONICS CO LTD1 citations45

UNIV INDUSTRY COOPERATION GROUP KYUNG HEE UNIV

8 patents

LG ELECTRONICS INC

4 patents

LG NORTEL CO LTD

2 patents

SOOSAN SPECIAL PURPOSE VEHICLE

1 patent

SAMSUNG ELECTRO MECH

1 patent

ELECT & TELECOMM RESEARCH INST

1 patent

UNIV YONSEI IACF

1 patent

KIM JINWOO

1 patent

HUH HOON

1 patent

GLOBALFOUNDRIES INC

1 patent

LG CHEMICAL LTD

1 patent