Inventor
FIGUEREDO DOMINGO A
US16 patents
⚠️ This page may combine multiple inventors who share the name “FIGUEREDO DOMINGO A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD CO
7 patentsUS5883650AMar 16, 1999
Thin-film printhead device for an ink-jet printer
HEWLETT PACKARD CO114 citations97
US6286939B1Sep 11, 2001
Method of treating a metal surface to increase polymer adhesion
HEWLETT PACKARD CO32 citations92
US6209991B1Apr 3, 2001
Transition metal carbide films for applications in ink jet printheads
HEWLETT PACKARD CO25 citations92
US6153114ANov 28, 2000
Thin-film printhead device for an ink-jet printer
HEWLETT PACKARD CO30 citations92
US6155674ADec 5, 2000
Structure to effect adhesion between substrate and ink barrier in ink jet printhead
HEWLETT PACKARD CO37 citations91
US6239820B1May 29, 2001
Thin-film printhead device for an ink-jet printer
HEWLETT PACKARD CO18 citations83
US6441838B1Aug 27, 2002
Method of treating a metal surface to increase polymer adhesion
HEWLETT PACKARD CO11 citations73
AGILENT TECHNOLOGIES INC
5 patentsUS6828713B2Dec 7, 2004
Resonator with seed layer
AGILENT TECHNOLOGIES INC235 citations99
US6714102B2Mar 30, 2004
Method of fabricating thin film bulk acoustic resonator (FBAR) and FBAR structure embodying the method
AGILENT TECHNOLOGIES INC138 citations99
US6710681B2Mar 23, 2004
Thin film bulk acoustic resonator (FBAR) and inductor on a monolithic substrate and method of fabricating the same
AGILENT TECHNOLOGIES INC145 citations99
US6787897B2Sep 7, 2004
Wafer-level package with silicon gasket
AGILENT TECHNOLOGIES INC65 citations94
US6979597B2Dec 27, 2005
Wafer-level package with silicon gasket
AGILENT TECHNOLOGIES INC32 citations91