Inventor
EMAMJOMEH ALI
US62 patents
⚠️ This page may combine multiple inventors who share the name “EMAMJOMEH ALI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
31 patentsUS10392512B2Aug 27, 2019
Detailing agent for three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO7 citations83
US11104065B2Aug 31, 2021
Material sets
HEWLETT PACKARD DEVELOPMENT CO6 citations81
US10471698B2Nov 12, 2019
Computational model and three-dimensional (3D) printing methods
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US6659596B1Dec 9, 2003
Ink-jet printhead and method for producing the same
HEWLETT PACKARD DEVELOPMENT CO7 citations73
US11732150B2Aug 22, 2023
Composite particulate build materials
HEWLETT PACKARD DEVELOPMENT CO2 citations72
US11413816B2Aug 16, 2022
Compositions for printing
HEWLETT PACKARD DEVELOPMENT CO2 citations72
US11014306B2May 25, 2021
Generating three-dimensional objects with target surface roughness
HEWLETT PACKARD DEVELOPMENT CO4 citations72
US10392521B2Aug 27, 2019
Particle compositions for three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO6 citations72
US11485870B2Nov 1, 2022
Material sets
HEWLETT PACKARD DEVELOPMENT CO4 citations70
US10301490B2May 28, 2019
Three-dimensional (3D) printing system
HEWLETT PACKARD DEVELOPMENT CO2 citations67
US11254068B2Feb 22, 2022
Three-dimensional (3D) printing method
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US10889057B2Jan 12, 2021
Material sets
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US7048359B2May 23, 2006
Ink-jet printhead and method for producing the same
HEWLETT PACKARD DEVELOPMENT CO3 citations62
US12116491B2Oct 15, 2024
Composite particulate build materials
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US12049041B2Jul 30, 2024
3-D printing
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US12042986B2Jul 23, 2024
3-dimensional printed parts
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11718024B2Aug 8, 2023
3-D printing
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11679553B2Jun 20, 2023
Compositions for printing
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11458675B2Oct 4, 2022
Material sets
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11235521B2Feb 1, 2022
3-D printing
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11173659B2Nov 16, 2021
Coalescing agent for three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US10894356B2Jan 19, 2021
Coating part precursors
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11628619B2Apr 18, 2023
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations60
US11613670B2Mar 28, 2023
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations60
US11426931B2Aug 30, 2022
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations60
US11298876B2Apr 12, 2022
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations60
US10800153B2Oct 13, 2020
Generating three-dimensional objects
HEWLETT PACKARD DEVELOPMENT CO1 citations60
US12110362B2Oct 8, 2024
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations59
US10576685B2Mar 3, 2020
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10640661B2May 5, 2020
Coalescing agent for three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US10239326B2Mar 26, 2019
Pre-treatment fixing fluid for an offset coated medium
HEWLETT PACKARD DEVELOPMENT CO0 citations51
HEWLETT PACKARD CO
8 patentsUS6341845B1Jan 29, 2002
Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead dies
HEWLETT PACKARD CO248 citations99
US6244696B1Jun 12, 2001
Inkjet print cartridge design for decreasing ink shorts by using an elevated substrate support surface to increase adhesive sealing of the printhead from ink penetration
HEWLETT PACKARD CO87 citations98
US6464333B1Oct 15, 2002
Inkjet printhead assembly with hybrid carrier for printhead dies
HEWLETT PACKARD CO56 citations96
US6322200B1Nov 27, 2001
Decoupled nozzle plate and electrical flexible circuit for an inkjet print cartridge
HEWLETT PACKARD CO71 citations96
US6328428B1Dec 11, 2001
Ink-jet printhead and method of producing same
HEWLETT PACKARD CO21 citations93
US6209991B1Apr 3, 2001
Transition metal carbide films for applications in ink jet printheads
HEWLETT PACKARD CO25 citations92
US6155674ADec 5, 2000
Structure to effect adhesion between substrate and ink barrier in ink jet printhead
HEWLETT PACKARD CO37 citations91
US6523940B2Feb 25, 2003
Carrier for fluid ejection device
HEWLETT PACKARD CO12 citations74
SARKISIAN GEORGE
3 patentsNAT SEMICONDUCTOR CORP
3 patentsUS4876587AOct 24, 1989
One-piece interconnection package and process
NAT SEMICONDUCTOR CORP7 citations70
US4721992AJan 26, 1988
Hinge tape
NAT SEMICONDUCTOR CORP8 citations66
US4778564AOct 18, 1988
Process for producing an assembly tape for bonding metal fingers to electronic devices
NAT SEMICONDUCTOR CORP5 citations62
PERIDOT PRINT LLC
2 patentsHEWLETT PACKARD DEVELOPMENT CO LP
1 patentEMAMJOMEH ALI
1 patentSEN RADHA
1 patentShowing the top 50 of 62 patents by PatentIndex Score.