Inventor
HUO YAN
CN25 patents
⚠️ This page may combine multiple inventors who share the name “HUO YAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ALPHA & OMEGA SEMICONDUCTOR
5 patentsUS9653383B2May 16, 2017
Semiconductor device with thick bottom metal and preparation method thereof
ALPHA & OMEGA SEMICONDUCTOR15 citations83
US10043736B2Aug 7, 2018
Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures
ALPHA & OMEGA SEMICONDUCTOR0 citations52
US9425181B2Aug 23, 2016
Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures
ALPHA & OMEGA SEMICONDUCTOR0 citations52
US9337127B2May 10, 2016
Ultra-thin semiconductor device and preparation method thereof
ALPHA & OMEGA SEMICONDUCTOR0 citations51
US9337131B2May 10, 2016
Power semiconductor device and the preparation method
ALPHA & OMEGA SEMICONDUCTOR0 citations40
HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD
5 patentsUS11468543B1Oct 11, 2022
Neural-network for raw low-light image enhancement
HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD17 citations78
US12354241B1Jul 8, 2025
Diffusion-based multiple-modality image fusion
HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD4 citations71
US11962333B2Apr 16, 2024
Predicting compression ratio of data with compressible decision
HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD0 citations51
US11750213B1Sep 5, 2023
Train-linking lossless compressor of numeric values
HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD0 citations51
US12057864B2Aug 6, 2024
Hardware implementation of frequency table generation for Asymmetric-Numeral-System-based data compression
HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD0 citations45
YILMAZ HAMZA
2 patentsUS9054091B2Jun 9, 2015
Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
YILMAZ HAMZA6 citations84
US9087828B2Jul 21, 2015
Semiconductor device with thick bottom metal and preparation method thereof
YILMAZ HAMZA2 citations61