Inventor
TAKASAKI TADASHI
JP38 patents
⚠️ This page may combine multiple inventors who share the name “TAKASAKI TADASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
27 patentsUS10424520B1Sep 24, 2019
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP15 citations85
US11538661B1Dec 27, 2022
Substrate processing apparatus
KOKUSAI ELECTRIC CORP3 citations73
US10651068B1May 12, 2020
Method of manufacturing semiconductor device by setting process chamber to maintenance enable state
KOKUSAI ELECTRIC CORP1 citations72
US10453720B1Oct 22, 2019
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP3 citations72
US12424409B2Sep 23, 2025
Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12387949B2Aug 12, 2025
Substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations62
US12165894B2Dec 10, 2024
Processing method, method of manufacturing semiconductor, and substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations62
US12093021B2Sep 17, 2024
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11967513B2Apr 23, 2024
Substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations62
US11923173B2Mar 5, 2024
Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11749550B2Sep 5, 2023
Method of manufacturing semiconductor device by setting process chamber maintenance enable state
KOKUSAI ELECTRIC CORP0 citations62
US11747789B2Sep 5, 2023
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11380540B2Jul 5, 2022
Substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations62
US11355372B2Jun 7, 2022
Method of manufacturing semiconductor device by setting process chamber to maintenance enable state
KOKUSAI ELECTRIC CORP0 citations62
US11342212B2May 24, 2022
Method of manufacturing semiconductor device by setting process chamber maintenance enable state
KOKUSAI ELECTRIC CORP0 citations62
US11314234B2Apr 26, 2022
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11305986B2Apr 19, 2022
Method of manufacturing semiconductor device, substrate processing apparatus and program
KOKUSAI ELECTRIC CORP0 citations62
US10978310B2Apr 13, 2021
Method of manufacturing semiconductor device and non-transitory computer-readable recording medium capable of adjusting substrate temperature
KOKUSAI ELECTRIC CORP0 citations62
US10978361B2Apr 13, 2021
Substrate processing apparatus and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US10964531B1Mar 30, 2021
Method of manufacturing semiconductor device by supplying gas
KOKUSAI ELECTRIC CORP0 citations62
US10930533B2Feb 23, 2021
Substrate processing apparatus, substrate processing system and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations62
US11289350B2Mar 29, 2022
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP1 citations61
US12327755B2Jun 10, 2025
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations52
US11530481B2Dec 20, 2022
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations52
US12392032B2Aug 19, 2025
Substrate processing apparatus with cleaning of exhaust system
KOKUSAI ELECTRIC CORP0 citations51
US11422528B2Aug 23, 2022
Substrate processing system, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP0 citations51
US10503152B2Dec 10, 2019
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations42
HITACHI INT ELECTRIC INC
10 patentsUS8986450B1Mar 24, 2015
Substrate processing apparatus and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC8 citations84
US8925562B1Jan 6, 2015
Substrate processing apparatus and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC6 citations84
US10934622B2Mar 2, 2021
Substrate processing apparatus
HITACHI INT ELECTRIC INC5 citations73
US9728431B2Aug 8, 2017
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC2 citations73
US9508546B2Nov 29, 2016
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC3 citations73
US9163309B2Oct 20, 2015
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC5 citations73
US9070554B2Jun 30, 2015
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC4 citations73
US7943528B2May 17, 2011
Substrate processing apparatus and semiconductor devices manufacturing method
HITACHI INT ELECTRIC INC2 citations60
US11104995B2Aug 31, 2021
Substrate processing apparatus
HITACHI INT ELECTRIC INC0 citations52
US9659767B2May 23, 2017
Substrate processing apparatus and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC1 citations52