Inventor
LI SHIJIAN
US88 patents
⚠️ This page may combine multiple inventors who share the name “LI SHIJIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
48 patentsUS6465051B1Oct 15, 2002
Method of operating high density plasma CVD reactor with combined inductive and capacitive coupling
APPLIED MATERIALS INC221 citations99
US6179709B1Jan 30, 2001
In-situ monitoring of linear substrate polishing operations
APPLIED MATERIALS INC181 citations99
US6070551AJun 6, 2000
Deposition chamber and method for depositing low dielectric constant films
APPLIED MATERIALS INC135 citations99
US5772771AJun 30, 1998
Deposition chamber for improved deposition thickness uniformity
APPLIED MATERIALS INC176 citations99
US6170428B1Jan 9, 2001
Symmetric tunable inductively coupled HDP-CVD reactor
APPLIED MATERIALS INC430 citations98
US6077357AJun 20, 2000
Orientless wafer processing on an electrostatic chuck
APPLIED MATERIALS INC105 citations98
US5761023AJun 2, 1998
Substrate support with pressure zones having reduced contact area and temperature feedback
APPLIED MATERIALS INC218 citations98
US6413873B1Jul 2, 2002
System for chemical mechanical planarization
APPLIED MATERIALS INC85 citations97
US6083344AJul 4, 2000
Multi-zone RF inductively coupled source configuration
APPLIED MATERIALS INC346 citations97
US6833052B2Dec 21, 2004
Deposition chamber and method for depositing low dielectric constant films
APPLIED MATERIALS INC65 citations96
US6796880B2Sep 28, 2004
Linear polishing sheet with window
APPLIED MATERIALS INC42 citations96
US6709316B1Mar 23, 2004
Method and apparatus for two-step barrier layer polishing
APPLIED MATERIALS INC64 citations96
US6589610B2Jul 8, 2003
Deposition chamber and method for depositing low dielectric constant films
APPLIED MATERIALS INC53 citations96
US6585563B1Jul 1, 2003
In-situ monitoring of linear substrate polishing operations
APPLIED MATERIALS INC35 citations96
US6541384B1Apr 1, 2003
Method of initiating cooper CMP process
APPLIED MATERIALS INC54 citations96
US6524167B1Feb 25, 2003
Method and composition for the selective removal of residual materials and barrier materials during substrate planarization
APPLIED MATERIALS INC72 citations96
US6416823B2Jul 9, 2002
Deposition chamber and method for depositing low dielectric constant films
APPLIED MATERIALS INC61 citations96
US7220322B1May 22, 2007
Cu CMP polishing pad cleaning
APPLIED MATERIALS INC21 citations93
US7059948B2Jun 13, 2006
Articles for polishing semiconductor substrates
APPLIED MATERIALS INC25 citations93
US6991517B2Jan 31, 2006
Linear polishing sheet with window
APPLIED MATERIALS INC29 citations93
US6887129B2May 3, 2005
Chemical mechanical polishing with friction-based control
APPLIED MATERIALS INC29 citations93
US6858540B2Feb 22, 2005
Selective removal of tantalum-containing barrier layer during metal CMP
APPLIED MATERIALS INC21 citations93
US6821881B2Nov 23, 2004
Method for chemical mechanical polishing of semiconductor substrates
APPLIED MATERIALS INC17 citations93
US6676497B1Jan 13, 2004
Vibration damping in a chemical mechanical polishing system
APPLIED MATERIALS INC33 citations93
US6656842B2Dec 2, 2003
Barrier layer buffing after Cu CMP
APPLIED MATERIALS INC41 citations93
US6653242B1Nov 25, 2003
Solution to metal re-deposition during substrate planarization
APPLIED MATERIALS INC33 citations93
US6623334B1Sep 23, 2003
Chemical mechanical polishing with friction-based control
APPLIED MATERIALS INC41 citations93
US6613200B2Sep 2, 2003
Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
APPLIED MATERIALS INC33 citations93
US6592742B2Jul 15, 2003
Electrochemically assisted chemical polish
APPLIED MATERIALS INC31 citations93
US6451697B1Sep 17, 2002
Method for abrasive-free metal CMP in passivation domain
APPLIED MATERIALS INC38 citations93
US6251187B1Jun 26, 2001
Gas distribution in deposition chambers
APPLIED MATERIALS INC26 citations93
US6162368ADec 19, 2000
Technique for chemical mechanical polishing silicon
APPLIED MATERIALS INC36 citations93
US6790768B2Sep 14, 2004
Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects
APPLIED MATERIALS INC13 citations92
US6669538B2Dec 30, 2003
Pad cleaning for a CMP system
APPLIED MATERIALS INC32 citations92
US6432826B1Aug 13, 2002
Planarized Cu cleaning for reduced defects
APPLIED MATERIALS INC35 citations92
US6322427B1Nov 27, 2001
Conditioning fixed abrasive articles
APPLIED MATERIALS INC35 citations92
US6261157B1Jul 17, 2001
Selective damascene chemical mechanical polishing
APPLIED MATERIALS INC52 citations92
US7513062B2Apr 7, 2009
Single wafer dryer and drying methods
APPLIED MATERIALS INC23 citations91
US6955516B2Oct 18, 2005
Single wafer dryer and drying methods
APPLIED MATERIALS INC33 citations91
US7014538B2Mar 21, 2006
Article for polishing semiconductor substrates
APPLIED MATERIALS INC27 citations90
US6592439B1Jul 15, 2003
Platen for retaining polishing material
APPLIED MATERIALS INC22 citations90
US7497767B2Mar 3, 2009
Vibration damping during chemical mechanical polishing
APPLIED MATERIALS INC8 citations84
US7041599B1May 9, 2006
High through-put Cu CMP with significantly reduced erosion and dishing
APPLIED MATERIALS INC14 citations84
US6872329B2Mar 29, 2005
Chemical mechanical polishing composition and process
APPLIED MATERIALS INC15 citations84
US6863794B2Mar 8, 2005
Method and apparatus for forming metal layers
APPLIED MATERIALS INC18 citations84
US6858265B2Feb 22, 2005
Technique for improving chucking reproducibility
APPLIED MATERIALS INC13 citations84
US6509269B2Jan 21, 2003
Elimination of pad glazing for Al CMP
APPLIED MATERIALS INC14 citations84
US6485359B1Nov 26, 2002
Platen arrangement for a chemical-mechanical planarization apparatus
APPLIED MATERIALS INC16 citations84
LAM RES CORP
1 patentKOLICS ARTUR
1 patentShowing the top 50 of 88 patents by PatentIndex Score.