Inventor
BENNETT JENNIFER
US7 patents
Patents
7 patentsUS10575448B1Feb 25, 2020
Electromagnetic shielding of heat sinks with shape-memory alloy grounding
IBM20 citations92
US10677856B2Jun 9, 2020
Facilitating reliable circuit board press-fit connector assembly fabrication
IBM2 citations70
US10262907B1Apr 16, 2019
Dye and pry process for removing quad flat no-lead packages and bottom termination components
IBM2 citations70
US11245238B2Feb 8, 2022
Tool for shaping contact tab interconnects at a circuit card edge
IBM0 citations49
US10667433B2May 26, 2020
Implementing contained thermal interface material for pluggable applications
IBM0 citations49
US10593601B2Mar 17, 2020
Dye and pry process for removing quad flat no-lead packages and bottom termination components
IBM0 citations49
US11268809B2Mar 8, 2022
Detecting and correcting deficiencies in surface conditions for bonding applications
IBM0 citations48