Inventor
LEWIS THERON L
US12 patents
Patents
12 patentsUS10575448B1Feb 25, 2020
Electromagnetic shielding of heat sinks with shape-memory alloy grounding
IBM20 citations92
US10677856B2Jun 9, 2020
Facilitating reliable circuit board press-fit connector assembly fabrication
IBM2 citations70
US10262907B1Apr 16, 2019
Dye and pry process for removing quad flat no-lead packages and bottom termination components
IBM2 citations70
US11175100B2Nov 16, 2021
Heat sinks using memory shaping materials
IBM0 citations61
US10073134B2Sep 11, 2018
Laminate bond strength detection
IBM0 citations50
US9910085B2Mar 6, 2018
Laminate bond strength detection
IBM0 citations50
US11245238B2Feb 8, 2022
Tool for shaping contact tab interconnects at a circuit card edge
IBM0 citations49
US10593601B2Mar 17, 2020
Dye and pry process for removing quad flat no-lead packages and bottom termination components
IBM0 citations49
US11268809B2Mar 8, 2022
Detecting and correcting deficiencies in surface conditions for bonding applications
IBM0 citations48
US9059373B2Jun 16, 2015
Protecting a thermal sensitive component in a thermal process
IBM1 citations44
US9402320B2Jul 26, 2016
Electronic component assembly
IBM0 citations40
US7975379B2Jul 12, 2011
Method of making a land-grid-array (LGA) interposer
IBM0 citations39