Inventor
DIGLIO PAUL
US14 patents
Patents
14 patentsUS12057370B2Aug 6, 2024
Vacuum modulated two phase cooling loop efficiency and parallelism enhancement
INTEL CORP2 citations72
US9791501B2Oct 17, 2017
Compliant thermal contact device and method
INTEL CORP4 citations69
US11808988B2Nov 7, 2023
Method and device for fast, passive alignment in photonics assembly
INTEL CORP2 citations68
US12532740B2Jan 20, 2026
Porous mesh structures for the thermal management of integrated circuit devices
INTEL CORP0 citations62
US11976671B2May 7, 2024
Vacuum modulated two phase cooling loop performance enhancement
INTEL CORP0 citations62
US12136577B2Nov 5, 2024
Integrated circuit die packages including a contiguous heat spreader
INTEL CORP0 citations61
US12021016B2Jun 25, 2024
Thermally enhanced silicon back end layers for improved thermal performance
INTEL CORP0 citations61
US11073538B2Jul 27, 2021
Electrical testing apparatus with lateral movement of a probe support substrate
INTEL CORP1 citations60
US12493151B2Dec 9, 2025
Method and device for fast, passive alignment in photonics assembly
INTEL CORP0 citations57
US12500137B2Dec 16, 2025
Directly impinging pressure modulated spray cooling and methods of target temperature control
INTEL CORP0 citations56
US11762157B2Sep 19, 2023
Method and system for attaching optical fibers to warped photonic chips
INTEL CORP0 citations55
US12000487B2Jun 4, 2024
System and apparatus having a seal member for sealing of a device under test
INTEL CORP0 citations54
US12392818B2Aug 19, 2025
Enhanced jet impingement leak prevention for integrated circuit
INTEL CORP0 citations50
US12080620B2Sep 3, 2024
Additively manufactured structures for heat dissipation from integrated circuit devices
INTEL CORP0 citations50