Inventor

TAO JUNLEI

CN2 patents

Patents

2 patents

US11276645B2Mar 15, 2022

Encapsulation of a substrate electrically connected to a plurality of pin arrays

HUAWEI TECH CO LTD1 citations53

US12550726B2Feb 10, 2026

Package chip having a heat sink and method for manufacturing package chip

HUAWEI TECH CO LTD0 citations45