Inventor
CHIANG SHANGHSUAN
CN3 patents
Patents
3 patentsUS11276645B2Mar 15, 2022
Encapsulation of a substrate electrically connected to a plurality of pin arrays
HUAWEI TECH CO LTD1 citations53
US12266617B2Apr 1, 2025
Chip package, electronic device, and chip package preparation method
HUAWEI TECH CO LTD0 citations52
US12550726B2Feb 10, 2026
Package chip having a heat sink and method for manufacturing package chip
HUAWEI TECH CO LTD0 citations45