Inventor
WU PO-YI
TW28 patents
⚠️ This page may combine multiple inventors who share the name “WU PO-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FOCI FIBER OPTIC COMMUNICATIONS INC
8 patentsUS11921334B2Mar 5, 2024
Alignment structure of optical element
FOCI FIBER OPTIC COMMUNICATIONS INC2 citations70
US12306448B2May 20, 2025
Alignment structure of optical element
FOCI FIBER OPTIC COMMUNICATIONS INC0 citations59
US12449609B2Oct 21, 2025
Semiconductor structure
FOCI FIBER OPTIC COMMUNICATIONS INC0 citations54
US12197022B2Jan 14, 2025
Assembly alignment structure for optical component
FOCI FIBER OPTIC COMMUNICATIONS INC0 citations49
US11947172B2Apr 2, 2024
Optical probe package structure
FOCI FIBER OPTIC COMMUNICATIONS INC0 citations49
US11803015B2Oct 31, 2023
Optical probe for optoelectronic integrated circuits
FOCI FIBER OPTIC COMMUNICATIONS INC0 citations49
US12468098B2Nov 11, 2025
Optical interposer for chip connection
FOCI FIBER OPTIC COMMUNICATIONS INC0 citations44
US12411295B2Sep 9, 2025
Pluggable optical packing structure
FOCI FIBER OPTIC COMMUNICATIONS INC0 citations41
SILICONWARE PRECISION INDUSTRIES CO LTD
7 patentsUS9903024B2Feb 27, 2018
Substrate having electrical interconnection structures and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations72
US11913121B2Feb 27, 2024
Fabrication method of substrate having electrical interconnection structures
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US10774427B2Sep 15, 2020
Fabrication method of substrate having electrical interconnection structures
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US10811367B2Oct 20, 2020
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US10340228B2Jul 2, 2019
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9786610B2Oct 10, 2017
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US10192838B2Jan 29, 2019
Fabrication method of packaging substrate
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations46
POWERCHIP SEMICONDUCTOR MFG CORP
4 patentsUS11367727B2Jun 21, 2022
Memory structure
POWERCHIP SEMICONDUCTOR MFG CORP0 citations60
US11367728B2Jun 21, 2022
Memory structure
POWERCHIP SEMICONDUCTOR MFG CORP0 citations60
US10868017B2Dec 15, 2020
Memory structure and manufacturing method thereof
POWERCHIP SEMICONDUCTOR MFG CORP0 citations50
US11152370B2Oct 19, 2021
Memory structure having transistors and capacitor and manufacturing method thereof
POWERCHIP SEMICONDUCTOR MFG CORP0 citations43