Inventor
KABIR MOHAMMAD ENAMUL
US10 patents
Patents
10 patentsUS12199018B2Jan 14, 2025
Direct bonding in microelectronic assemblies
INTEL CORP2 citations75
US12107060B2Oct 1, 2024
Microelectronic assemblies with inductors in direct bonding regions
INTEL CORP5 citations75
US12165962B2Dec 10, 2024
Hermetic sealing structures in microelectronic assemblies having direct bonding
INTEL CORP3 citations74
US12062631B2Aug 13, 2024
Microelectronic assemblies with inductors in direct bonding regions
INTEL CORP4 citations74
US12581968B2Mar 17, 2026
Package architecture of large dies using quasi-monolithic chip layers
INTEL CORP0 citations60
US12438102B2Oct 7, 2025
Hermetic barrier surrounding a plurality of dies
INTEL CORP0 citations55
US12266682B2Apr 1, 2025
Capacitors and resistors at direct bonding interfaces in microelectronic assemblies
INTEL CORP0 citations52
US12538841B2Jan 27, 2026
Quasi-monolithic die architectures
INTEL CORP0 citations50
US12469801B2Nov 11, 2025
Moisture seal coating of hybrid bonded stacked die package assembly
INTEL CORP0 citations50
US12347807B2Jul 1, 2025
Inorganic fill material for stacked die assembly
INTEL CORP0 citations50