Inventor
ZHAO JINYAN
JP14 patents
Patents
14 patentsUS8753923B2Jun 17, 2014
Wafer processing method
DISCO CORP8 citations83
US11348797B2May 31, 2022
Stacked wafer processing method
DISCO CORP2 citations72
US10515840B2Dec 24, 2019
Expanding method and expanding apparatus
DISCO CORP3 citations72
US10804154B2Oct 13, 2020
Wafer processing method
DISCO CORP3 citations71
US10468255B2Nov 5, 2019
Wafer processing method
DISCO CORP3 citations71
US10879122B2Dec 29, 2020
Wafer processing method
DISCO CORP1 citations62
US12354902B2Jul 8, 2025
Wafer processing method
DISCO CORP0 citations61
US11325804B2May 10, 2022
Tape attaching method
DISCO CORP0 citations61
US12300544B2May 13, 2025
Expanding method and expanding apparatus
DISCO CORP1 citations60
US11569129B2Jan 31, 2023
Workpiece processing method
DISCO CORP0 citations51
US11315821B2Apr 26, 2022
Processing method for wafer
DISCO CORP0 citations50
US11315833B2Apr 26, 2022
Wafer processing method including a test element group (TEG) cutting step
DISCO CORP0 citations50
US11158541B2Oct 26, 2021
Method of processing wafer
DISCO CORP0 citations50
US12374587B2Jul 29, 2025
Method of processing workpiece
DISCO CORP0 citations44