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Inventor
SEGGERN WALTER VON
US
2 patents
Patents
2 patents
US5950070A
Sep 7, 1999
Method of forming a chip scale package, and a tool used in forming the chip scale package
KULICKE & SOFFA INVESTMENTS
184 citations
96
US6136681A
Oct 24, 2000
Tool used in forming a chip scale package
KULICKE & SOFFA INVESTMENTS
17 citations
89