Inventor
BECKAGE PETER J
US16 patents
⚠️ This page may combine multiple inventors who share the name “BECKAGE PETER J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
13 patentsUS6368184B1Apr 9, 2002
Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes
ADVANCED MICRO DEVICES INC190 citations98
US6666754B1Dec 23, 2003
Method and apparatus for determining CMP pad conditioner effectiveness
ADVANCED MICRO DEVICES INC27 citations92
US6555479B1Apr 29, 2003
Method for forming openings for conductive interconnects
ADVANCED MICRO DEVICES INC31 citations92
US6489240B1Dec 3, 2002
Method for forming copper interconnects
ADVANCED MICRO DEVICES INC23 citations92
US5934978AAug 10, 1999
Methods of making and using a chemical-mechanical polishing slurry that reduces wafer defects
ADVANCED MICRO DEVICES INC27 citations92
US6051495AApr 18, 2000
Seasoning of a semiconductor wafer polishing pad to polish tungsten
ADVANCED MICRO DEVICES INC25 citations91
US6179688B1Jan 30, 2001
Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation
ADVANCED MICRO DEVICES INC18 citations87
US6809032B1Oct 26, 2004
Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniques
ADVANCED MICRO DEVICES INC18 citations84
US6413846B1Jul 2, 2002
Contact each methodology and integration scheme
ADVANCED MICRO DEVICES INC15 citations84
US6325705B2Dec 4, 2001
Chemical-mechanical polishing slurry that reduces wafer defects and polishing system
ADVANCED MICRO DEVICES INC11 citations74
US6514858B1Feb 4, 2003
Test structure for providing depth of polish feedback
ADVANCED MICRO DEVICES INC8 citations73
US6572443B1Jun 3, 2003
Method and apparatus for detecting a process endpoint
ADVANCED MICRO DEVICES INC5 citations68
US6168640B1Jan 2, 2001
Chemical-mechanical polishing slurry that reduces wafer defects
ADVANCED MICRO DEVICES INC2 citations63
FREESCALE SEMICONDUCTOR INC
3 patentsUS7670895B2Mar 2, 2010
Process of forming an electronic device including a semiconductor layer and another layer adjacent to an opening within the semiconductor layer
FREESCALE SEMICONDUCTOR INC13 citations82
US7378306B2May 27, 2008
Selective silicon deposition for planarized dual surface orientation integration
FREESCALE SEMICONDUCTOR INC14 citations82
US7754587B2Jul 13, 2010
Silicon deposition over dual surface orientation substrates to promote uniform polishing
FREESCALE SEMICONDUCTOR INC4 citations62