Inventor
MASUMOTO KENJI
JP24 patents
⚠️ This page may combine multiple inventors who share the name “MASUMOTO KENJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
18 patentsUS6759745B2Jul 6, 2004
Semiconductor device and manufacturing method thereof
TEXAS INSTRUMENTS INC56 citations96
US6482730B1Nov 19, 2002
Method for manufacturing a semiconductor device
TEXAS INSTRUMENTS INC67 citations96
US6780749B2Aug 24, 2004
Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges
TEXAS INSTRUMENTS INC63 citations95
US7005719B2Feb 28, 2006
Integrated circuit structure having a flip-chip mounted photoreceiver
TEXAS INSTRUMENTS INC27 citations92
US6992380B2Jan 31, 2006
Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area
TEXAS INSTRUMENTS INC21 citations92
US6734532B2May 11, 2004
Back side coating of semiconductor wafers
TEXAS INSTRUMENTS INC22 citations92
US6583483B2Jun 24, 2003
Semiconductor device and its manufacturing method
TEXAS INSTRUMENTS INC18 citations92
US5258331ANov 2, 1993
Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
TEXAS INSTRUMENTS INC38 citations92
US6269999B1Aug 7, 2001
Semiconductor chip mounting method utilizing ultrasonic vibrations
TEXAS INSTRUMENTS INC41 citations91
US6830956B2Dec 14, 2004
Method for packaging a low profile semiconductor device
TEXAS INSTRUMENTS INC17 citations84
US5176366AJan 5, 1993
Resin-encapsulated semiconductor device package with nonconductive tape embedded between outer lead portions
TEXAS INSTRUMENTS INC19 citations74
US6929971B2Aug 16, 2005
Semiconductor device and its manufacturing method
TEXAS INSTRUMENTS INC7 citations73
US6525424B2Feb 25, 2003
Semiconductor device and its manufacturing method
TEXAS INSTRUMENTS INC10 citations73
US6894374B2May 17, 2005
Semiconductor package insulation film and manufacturing method thereof
TEXAS INSTRUMENTS INC5 citations63
US6875637B2Apr 5, 2005
Semiconductor package insulation film and manufacturing method thereof
TEXAS INSTRUMENTS INC6 citations63
US6876077B2Apr 5, 2005
Semiconductor device and its manufacturing method
TEXAS INSTRUMENTS INC2 citations62
US7679002B2Mar 16, 2010
Semiconductive device having improved copper density for package-on-package applications
TEXAS INSTRUMENTS INC0 citations52
US7344916B2Mar 18, 2008
Package for a semiconductor device
TEXAS INSTRUMENTS INC0 citations52