Inventor

GRIGG FORD B

US54 patents

⚠️ This page may combine multiple inventors who share the name “GRIGG FORD B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GRIGG FORD B

MICRON TECHNOLOGY INC

Semiconductor device assemblies including interposers with dams protruding therefrom

Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods

Thin flip—chip method

Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards

Methods for labeling semiconductor device components

Stereolithographically marked semiconductors devices and methods

Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask

Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same

Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad

Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad

LOC semiconductor assembled with room temperature adhesive

LOC semiconductor assembled with room temperature adhesive

Stereolithographically marked semiconductor devices and methods

Stereolithographically marked semiconductor devices and methods

Thin flip-chip method

Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same

Thin flip-chip method

Support ring for use with a contact pad and semiconductor device components including the same

Microelectronic devices and methods for mounting microelectronic packages to circuit boards

Semiconductor device assemblies including interposers with dams protruding therefrom

Thin flip-chip method

Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad

Support ring for use with a contact pad and semiconductor device components including the same

Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same

Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same

Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask

Methods for labeling semiconductor device components

Stereolithographically marked semiconductor devices and methods

Stereolithographically marked semiconductor devices and methods

Method and stencil for extruding material on a substrate

Method and stencil for extruding material on a substrate

Methods for finishing microelectronic device packages

Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask

Methods for fabricating interposers including upwardly protruding dams

LOC semiconductor assembled with room temperature adhesive

Methods for providing support for conductive structures protruding from semiconductor device components

Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same

Method of manufacturing LOC semiconductor assembled with room temperature adhesive

Method of manufacturing LOC semiconductor assembled with room temperature adhesive

LOC semiconductor assembled with room temperature adhesive

Method and stencil for extruding material on a substrate

Method and stencil for extruding material on a substrate

Method and stencil for extruding material on a substrate

Method for fabricating interposers including upwardly protruding dams, semiconductor device assemblies including the interposers

LOC semiconductor assembled with room temperature adhesive

Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same

LOC semiconductor assembled with room temperature adhesive

LOC semiconductor assembled with room temperature adhesive

MICRON COMMUNICATIONS INC

Thin profile battery apparatus, battery powerable apparatus, radio frequency communication device, and method of forming battery powerable apparatus

WOOD ALAN G

Microelectronic device wafers and methods of manufacturing