Inventor
SHIU HEI MING
HK10 patents
⚠️ This page may combine multiple inventors who share the name “SHIU HEI MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
9 patentsUS7205178B2Apr 17, 2007
Land grid array packaged device and method of forming same
FREESCALE SEMICONDUCTOR INC69 citations93
US7056766B2Jun 6, 2006
Method of forming land grid array packaged device
FREESCALE SEMICONDUCTOR INC20 citations92
US7112871B2Sep 26, 2006
Flipchip QFN package
FREESCALE SEMICONDUCTOR INC19 citations90
US6867072B1Mar 15, 2005
Flipchip QFN package and method therefor
FREESCALE SEMICONDUCTOR INC43 citations90
US6905910B1Jun 14, 2005
Method of packaging an optical sensor
FREESCALE SEMICONDUCTOR INC14 citations81
US7262494B2Aug 28, 2007
Three-dimensional package
FREESCALE SEMICONDUCTOR INC7 citations71
US7494924B2Feb 24, 2009
Method for forming reinforced interconnects on a substrate
FREESCALE SEMICONDUCTOR INC2 citations58
US7422973B2Sep 9, 2008
Method for forming multi-layer bumps on a substrate
FREESCALE SEMICONDUCTOR INC3 citations58
US7279409B2Oct 9, 2007
Method for forming multi-layer bumps on a substrate
FREESCALE SEMICONDUCTOR INC4 citations58